Dual-Flow Liquid Connectors for Compact Module Cooling
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Solution Overview
Problem
State-of-the-art electronic assemblies using the VITA 48.2 AFT standard for liquid flow through cooling face complexity issues due to liquid entry through the backplane, which complicates assembly and increases fluid manifold complexity, occupying valuable input/output design space.
Innovation Solution
The introduction of a chassis liquid dual-flow connector and module liquid dual-flow connector arrangement that establishes a quick disconnect system with inner and outer liquid flow paths, allowing for efficient liquid cooling while maintaining a compact design by ensuring the inner flow path is established before the outer path, reducing assembly complexity and space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling is implemented through the backplane according to VITA 48.2 AFT standard, then thermal performance is improved, but device complexity and assembly complexity increase
Solution Approach 1:
The liquid cooling system is segmented into separate chassis connector and module connector components, allowing independent assembly and reducing overall assembly complexity while maintaining thermal performance
Solution Approach 2:
The liquid cooling connection is extracted from the backplane and implemented through dedicated dual-flow connectors on the chassis and modules, simplifying the backplane design and reducing assembly complexity
2Temperature
If liquid cooling manifolds are integrated with backplane, then thermal management is improved, but valuable input/output design space is occupied
Solution Approach 1:
The liquid cooling connection functionality is extracted from the backplane and implemented through dedicated dual-flow connectors positioned separately, freeing up backplane input/output design space while maintaining thermal management capabilities
Solution Approach 2:
The liquid cooling connection is moved from the two-dimensional backplane surface to a three-dimensional connector arrangement, allowing thermal management functionality without occupying valuable backplane I/O space
3Ease of operation
If quick disconnect connector arrangement is implemented with inner and outer flow paths, then assembly ease is improved, but device complexity increases
Solution Approach 1:
The inner flow path is established before the outer flow path during the mating process, ensuring proper sealing and cooling functionality before full connection is achieved, which simplifies the assembly process
Solution Approach 2:
The connector design features nested inner and outer flow paths where the inner path is surrounded by the outer path, allowing compact integration while maintaining sequential establishment during mating
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal performance by ensuring efficient liquid cooling with reduced assembly complexity and space usage, facilitating easier integration of electronic modules while maintaining a compact footprint.
Implementation Method 1
A new industry standard, however, encourages the increased use of liquid flow through (LFT) cooling to reduce dependence on conduction cooling
Implementation Method 2
The chassis liquid dual-flow connector and module liquid dual-flow connector establish thermal contact for efficient heat transfer from electronic components to the cooling liquid
Implementation Method 3
The chassis liquid dual-flow connector and module liquid dual-flow connector establish an inner liquid flow path and an outer liquid flow path surrounding the inner liquid flow path when in a fully mated position
Data Source
AI summary
An electronic assembly may include a chassis having electronic module mounting positions. Each mounting position may have associated therewith a chassis liquid dual-flow connector. A respective electronic module may be received in each electronic module mounting position and include a circuit board, a liquid cooling path associated with the circuit board, and a module liquid dual-flow connector coupled to the liquid cooling path and configured to be mateable with the chassis liquid dual-flow connector.