Extruded Cooling Profile With Plastic Manifold for Flow Control
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Solution Overview
Problem
Existing cooling components for objects, particularly in battery systems and power electronics, require costly customization and inefficient heat transfer due to the use of metal or metal alloy connecting parts that are not intended for direct heat transfer, leading to high production costs and unnecessary thermal conductivity.
Innovation Solution
A cooling component using a metallic profile with parallel medium channels and plastic connection parts, featuring through-openings and fluid-tight connections, allowing for cost-effective production and allowing for precise control of the cooling medium flow through the use of a combination of through-openings and fluid-tight connections, allowing for the precise control of the cooling medium flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a conventional cooling device with a heat dissipation fin array is used, then heat dissipation function is provided, but the device occupies large space and has poor integration with semiconductor devices
Solution Approach 1:
The cooling device is integrated within the semiconductor device package structure, with the heat dissipation fin array nested between the semiconductor chip and the sealing plate. This nesting approach allows the cooling function to be embedded within the existing device volume without requiring additional external space, thereby reducing overall volume while maintaining heat dissipation efficiency.
Solution Approach 2:
The cooling device combines multiple functions into a single integrated structure: the heat dissipation fin array serves both as a thermal management component and as part of the sealing structure. The sealing plate simultaneously provides mechanical support, thermal conduction, and sealing functions. This merging of functions improves integration with semiconductor devices while maintaining effective heat dissipation.
2Reliability
If heat dissipation fins are provided in a sealing plate, then heat dissipation efficiency is improved, but manufacturing complexity increases due to multiple molding processes
Solution Approach 1:
The heat dissipation fins are integrated directly into the sealing plate structure, combining two previously separate components (sealing plate and heat dissipation fins) into a single molded part. This eliminates the need for separate attachment processes and reduces manufacturing complexity while maintaining the heat dissipation efficiency provided by the fin array.
Solution Approach 2:
The sealing plate is manufactured using injection molding with specific parameter optimizations: the material composition (polymer matrix with metal powder dispersion), molding temperature control, and cooling cycle parameters are adjusted to enable direct formation of the heat dissipation fins during the molding process itself, avoiding post-processing steps.
3Reliability
If metal powder is dispersed in polymer matrix, then thermal conductivity is improved, but manufacturing precision is reduced due to material inhomogeneity
Solution Approach 1:
The material composition parameters are optimized by controlling the metal powder concentration (30-70 wt%), particle size distribution (5-50 μm), and dispersion method. These parameter changes enable sufficient thermal conductivity enhancement while maintaining acceptable material homogeneity for injection molding processes.
Solution Approach 2:
The metal powder is pre-dispersed in the polymer matrix before injection molding, creating a homogeneous composite material in advance. This preliminary dispersion action ensures uniform thermal conductivity distribution throughout the sealing plate, preventing localized inhomogeneity that would affect manufacturing precision and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables cost-effective production and flexible adaptation to different application situations by using a combination of through-openings and fluid-tight connections, allowing for precise control of the cooling medium flow.
Implementation Method 1
a cooling liquid which circulates in the cooling device and cools the heat generating component
Implementation Method 2
a phase change material having a phase change temperature higher than a temperature of the heat generating component when the heat generating component is operated normally, in the sealing plate
Data Source
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AI summary
The present invention relates to a cooling component for cooling objects, comprising: at least one, preferably coated, metal profile element (11) which forms a heat sink; preferably an extruded profile element, in particular made of aluminum, the profile element (11) being elongate in particular and having a plurality of parallel medium channels (14), in particular elongate medium channels, for the flow of cooling medium therethrough, each medium channel being delimited by a medium channel wall (16) which extends peripherally, in particular extends peripherally in a rectangular shape in cross-section, and which is formed by the profile element (11); and a first connection part (12) connected to the profile element (11) fluid-tight and made of plastic and having a feed opening, through which cooling medium can be fed to the cooling component, and/or a discharge opening, through which cooling medium can be discharged from the cooling component, wherein the peripherally extending medium channel wall (16) of at least one of the parallel medium channels (14), preferably the peripherally extending medium channel wall (16) of a plurality or all of said medium channels (14), has, in the region of the first connection part (12), a through-opening (22) by which the medium channel (14) is fluidically connected to the feed opening or to the discharge opening of the first connection part (12), in particular a hole introduced into the peripherally extending medium channel wall (16).