Electronic Component Cooling via Recessed Body
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Solution Overview
Problem
Existing cooling devices for electronic components are costly to manufacture and inefficient in heat dissipation, particularly when solid cooling bodies are embedded in cooling plates, which increases production costs and weight.
Innovation Solution
A cooling device design featuring a cooling channel within a cooling body partially embedded in a recessed cooling plate, allowing for flexible arrangement and reduced material usage, with sections of the channel and pipe having various cross-sections for enhanced heat transfer, and using cost-effective materials like aluminum for the plates and cooling body.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solid cooling bodies are embedded in cooling plates, then cooling effectiveness is improved, but manufacturing costs and weight increase
Solution Approach 1:
The cooling device is divided into a cooling plate and a separate cooling body. The cooling body is positioned in a through recess of the cooling plate but not permanently embedded, allowing separate manufacturing of components and simpler assembly processes while maintaining effective thermal contact.
Solution Approach 2:
The cooling body is extracted from the cooling plate structure and placed in a through recess rather than being permanently embedded. This separation allows the cooling plate to be manufactured independently using cost-effective materials and methods, while the cooling body can be optimized for thermal performance.
2Reliability
If solid cooling bodies are embedded in cooling plates, then cooling effectiveness is improved, but device weight increases
Solution Approach 1:
By segmenting the cooling system into a plate structure and a separate cooling body positioned in a through recess, the design achieves effective cooling with reduced material usage. The cooling body can be made from lightweight materials like aluminum while maintaining thermal effectiveness.
Solution Approach 2:
The cooling body is positioned locally in a through recess where it is needed for heat dissipation, rather than using a solid cooling plate throughout. This localized approach reduces overall material usage and weight while maintaining cooling effectiveness at critical points.
3Adaptability or versatility
If through recesses are created in cooling plates, then component arrangement flexibility is improved, but manufacturing complexity increases
Solution Approach 1:
The through recess is created as a separate feature in the cooling plate, allowing the cooling body to be positioned flexibly for different component arrangements. The recess can be manufactured using standard machining methods and does not significantly complicate the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves effective cooling while minimizing production costs and weight, allowing for flexible component placement and improved heat dissipation through a combination of recessed channels and pipes, enhancing thermal conductivity and electromagnetic shielding.
Implementation Method 1
The cooling body (12) is made from a solid material with high heat conductivity, such as copper or aluminum
Implementation Method 2
A cooling medium (not shown) flows through the cooling body (12) by means of a cooling channel (not illustrated)
Data Source
AI summary
A cooling device for cooling at least one electronic component, as well as an electronic assembly with a cooling device and an electronic component. The cooling device has at least one cooling body through which a cooling medium flows. The cooling device further includes a cooling plate defining a through recess in which the cooling body is arranged at least in part. A through recess is particularly easy to produce, so that the complete cooling device can be manufactured very cost effectively. At least one cooling pipe in direct contact with the cooling plate and/or the electronic component to be cooled transports cooling medium from and to the cooling body, so that the cooling device can effectively absorb heat generated at the electronic component.