Modifications By Conduction Heat Transfer TRIZ Cases

A cooling assembly couples a heat exchanger directly to circuit board substrates for efficient thermal management.

A liquid handling block radiator integrates heat exchangers into information handling system chassis to transfer thermal energy from nodes.

Extending a heat conductor from the substrate toward heating elements lowers thermal resistance, preventing localized overheating in distributed power units.

Accommodating recesses and buffer parts secure the radiating component, preventing leakage during vibration while improving heat radiation efficiency.

A heat sink uses a tube body with circular and flat portions to transport thermal energy from an evaporation portion to a fin group.

A thermoplastic housing frame deforms to adjust a radiator's orientation for uniform thermal interface material thickness.

Sequentially stacked USFF receiver modules use conductive risers to provide electromagnetic shielding, resolving interference in compact multi-band designs.

A heat exchange assembly uses a thermal conduit to transfer heat between component and device exchangers.

A rack form-factor fluid reservoir stores coolant for cold plates or immersion servers.

Segmented fins with varying thickness resolve low heat sinking efficiency by improving thermal conduction to cooling water.

Stacked channel parts with intersecting directions delay critical heat flux by preventing flooding and dryout in high-power electronic cooling.

Stress relief grooves isolate mounting positions on radiator substrates to reduce thermal deformation stress between dissimilar materials.

A thermal conductor routes heat from components to an enclosure inlet, coupling with air-cooled sinks and thermoelectric devices.

An extruded shell paired with a die cast shell improves heat transfer for high throughput communication modules.

A cold plate uses a flow guide structure to direct working medium into heat absorption zones.

A heat dissipation structure uses non-overlapping support and thermal layers to maintain consistent temperature across vehicle display modules.

Distributor valves switch flow to a phase change material unit, maintaining safe temperatures during primary circuit failure.

Variable speed fans adjust airflow based on temperature readings to remove heat from downstream electronic assemblies.

A monolithic heat conduction structure transfers thermal energy through a bent single material to dissipate heat from photoelectric conversion modules.

A cuboidal electrical switch assembly integrates a TRIAC control module with a conductive heat sink that closes the housing opening.

A power element assembly structure uses a segmented heat sink design to improve layout flexibility and reduce main board area.

Segmentation separates the cooling body from the plate to lower manufacturing costs while maintaining thermal reliability.

A temperature control unit uses a porous metal body to disperse heat transfer media across its surface area.

Compressed interleaved graphite sheets spread heat while reducing weight compared to monolithic copper.

Segmented reinforcement supports thin fins to resolve the trade-off between high-density heat transfer area and structural rigidity.

A helical heat pipe links a biasing apparatus to an optical transceiver, eliminating air gaps that impair thermal contact.

A pluggable module unitary shell transfers heat from internal circuit boards through continuous thermal conduction paths.

Counter-flow diverging microchannels improve temperature uniformity and critical heat flux by enabling lateral thermal conduction between adjacent channels.

A manifold-integrated cold plate architecture directs liquid flow perpendicular to the server package floor plan.

Step grooves in the heat sink body accommodate heat pipes at different depths, eliminating sub heat sinks and reducing material costs.

A unified fan-less radiator integrates air-to-liquid and liquid-to-liquid heat exchange functions within a single passive unit.

Liquid cooling pipes draw heat from signal conditioner circuitry to maintain integrity at data rates exceeding 100 gigabits per second.

Segmented fluid and gas plates maintain optimal temperatures for multi-chip modules, reducing energy waste from over-cooling.

Axial cooling conduits in a metal extrusion remove thermal energy from electrical components while fluid-tight end caps prevent leakage.

Oblique angled interfaces between cold plates and vapor chambers create insertion force to resolve poor thermal conduction from parallel contact gaps.

A cooling rack integrates a common plate to dissipate heat from electronic units.