Modifications By Conduction Heat Transfer TRIZ Cases
- Directly Coupled Heat Exchanger Cooling Assembly
A cooling assembly couples a heat exchanger directly to circuit board substrates for efficient thermal management.
- Liquid Handling Block Radiator for IHS Thermal Management
A liquid handling block radiator integrates heat exchangers into information handling system chassis to transfer thermal energy from nodes.
- Heat Conductor Substrate for Circuit Board Thermal Management
Extending a heat conductor from the substrate toward heating elements lowers thermal resistance, preventing localized overheating in distributed power units.
- Electronic Control Unit Thermal Management with Radiating Component
Accommodating recesses and buffer parts secure the radiating component, preventing leakage during vibration while improving heat radiation efficiency.
- Heat Sink With Circular-Flat Tube For Leakage Prevention
A heat sink uses a tube body with circular and flat portions to transport thermal energy from an evaporation portion to a fin group.
- Thermoplastic Radiator Housing with Adjustable Orientation
A thermoplastic housing frame deforms to adjust a radiator's orientation for uniform thermal interface material thickness.