Helical Heat Pipe Thermal Coupling for Optical Transceivers
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Solution Overview
Problem
Conventional heat transfer methods in telecommunications, such as active cooling devices and passive heat sinks, face challenges due to air gaps and thermal resistance, which can lead to inefficient cooling and increased risk of overheating in components like network access nodes.
Innovation Solution
A device comprising a holder for the second module, a first unit thermally coupled to the first module, a second unit movable relative to the first unit and holder, a biasing apparatus to maintain contact pressure, and a liquid- and vapor-based heat-transferring apparatus forming a helical shape to enhance thermal coupling and reduce mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a passive heat sink is used to transfer heat from a module, then no electric power is required, but air gaps and thermal insulating structures impair heat transfer efficiency
Solution Approach 1:
The heat transfer device is divided into multiple units (first unit, second unit, third unit) that can be separately positioned and adjusted. This segmentation allows each unit to address specific thermal management needs while maintaining overall system efficiency without requiring continuous power input.
Solution Approach 2:
A biasing apparatus acts as an intermediary mechanism between the heat-generating module and the heat sink. This intermediary applies mechanical force to eliminate air gaps and ensure intimate thermal contact, thereby improving heat transfer efficiency without consuming electric power.
2Ease of manufacture
If air gaps and thermal insulating structures are present between module and heat sink, then thermal resistance increases, but manufacturing complexity and assembly difficulty increase
Solution Approach 1:
The biasing apparatus provides dynamic adjustment capability, allowing the heat sink assembly to adapt to variations in module dimensions and positioning. This dynamic mechanism ensures consistent thermal contact quality while accommodating manufacturing tolerances and simplifying assembly procedures.
Solution Approach 2:
The system utilizes mechanical force parameters applied by the biasing apparatus to change the contact pressure between thermal interfaces. By adjusting this parameter, optimal thermal contact is achieved without requiring precision manufacturing or complex assembly procedures.
3Reliability
If conventional heat transfer methods are used, then cooling is provided, but thermal resistance and air gaps lead to inefficient heat transfer and increased risk of overheating
Solution Approach 1:
The biasing apparatus is pre-configured to apply the necessary force to eliminate air gaps before heat transfer begins. This preliminary action ensures optimal thermal contact is established from the start, maximizing cooling effectiveness and minimizing energy loss throughout operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device improves thermal coupling between modules, enhancing heat transfer efficiency and maintaining effective cooling even over time, while reducing manufacturing costs and avoiding the drawbacks of air gaps and thermal resistance.
Implementation Method 1
a liquid- and vapor-based heat-transferring apparatus attached to the first unit and the second unit, wherein the heat-transferring apparatus thermally couples the second unit to the first unit
Implementation Method 2
The document US 2017/142864 Al shows a heat transfer between two devices using a heat pipe
Implementation Method 3
The biasing apparatus ensures a suitable contact pressure for good thermal transfer between the second module and the second unit. The biasing apparatus may comprise an elastic element or a resilient element (e.g. a spring)
Implementation Method 4
The heat-transferring apparatus forms a helical shape. An advantage with this implementation form is that the heat-transferring apparatus is able to distribute deflection and bending stress/moment such that the stress in the heat-transferring apparatus can be minimized
Data Source
Figure 1a
Figure 1b
Figure 1c~2
AI summary
The invention relates to a device (102; 102a, 102b) for transferring heat between a second module (106), for example an optical transceiver module (106), and a first module (104), for example a heat sink. The device (102; 102a, 102b) comprises a holder (108) for holding the second module (106), a first unit (110) configured to be thermally coupled to the first module (104), and a second unit (112) which is urged against the second module (106) placed in the holder (108) by a biasing apparatus (114.1, 114.2). The first unit (110) and the second unit (112) are thermally coupled to one another through a liquid- and vapor- based heat-transferring apparatus (116) such that an improved heat transfer can be provided between the first and second units (110, 112) and hence between the second module (106), and the first module (104). Furthermore, the invention also relates to an arrangement (200) including the device (102; 102a, 102b) and a network access node for a wireless communication system including any one of the device (102; 102a, 102b) and the arrangement (200).