Manifold-Integrated Cold Plate Architecture for Liquid Cooling
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Solution Overview
Problem
As central processing units (CPUs) and other components in data centers experience increasing thermal design power (TDP) and power density, air cooling methods reach their limits, leading to inefficiencies in cooling performance and increased costs due to higher coolant distribution unit costs.
Innovation Solution
The introduction of a manifold-integrated cold plate architecture that incorporates a bottom fin layer, middle layer for coolant split, and manifold for coolant distribution, which improves cooling capability by directing liquid flow perpendicular to the server package floor plan, reducing temperature gradients, and relaxing fin pitch requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional cold plate architecture is used, then manufacturing is simpler, but cooling performance is insufficient for high TDP devices
Solution Approach 1:
The cold plate is divided into multiple layers (bottom fin layer, middle layer, manifold layer) with distinct functions. The bottom fin layer contacts the device for heat transfer, the middle layer distributes coolant vertically, and the manifold layer handles horizontal coolant distribution. This segmentation allows each layer to be optimized for its specific function, achieving superior cooling performance for high TDP devices while maintaining manageable manufacturing complexity through modular construction.
Solution Approach 2:
The patent introduces vertical coolant flow through the middle layer, adding a vertical dimension to coolant distribution beyond the traditional horizontal flow. This multi-dimensional coolant distribution (both vertical and horizontal) improves cooling effectiveness by accessing heat sources from multiple directions, addressing the insufficient cooling performance of traditional single-plane cold plates.
2Temperature
If liquid flow is directed parallel to server package floor plan, then coolant distribution is simpler, but temperature gradients are higher
Solution Approach 1:
The middle layer introduces vertical coolant flow perpendicular to the server package floor plan, creating a multi-dimensional coolant distribution system. This vertical flow component reduces temperature gradients by delivering coolant directly to heat sources from above, complementing the horizontal flow in the manifold layer and achieving more uniform temperature distribution across the cooled device.
Solution Approach 2:
The multi-layer architecture enables localized coolant distribution where the middle layer can target specific vertical zones and the manifold layer can address different horizontal regions. This localized cooling approach reduces temperature gradients by providing tailored coolant flow to different areas of the device based on their thermal characteristics.
3Temperature
If fin pitch is reduced for better cooling, then cooling performance improves, but manufacturing difficulty increases
Solution Approach 1:
The bottom fin layer is separated from the manifold structure, allowing the fins to be manufactured independently with optimized pitch for cooling efficiency. This segmentation enables the use of standard manufacturing processes for the fin layer while the manifold layer handles the complex coolant distribution, achieving both good cooling performance and manufacturability.
Solution Approach 2:
By introducing the vertical middle layer for coolant distribution, the system reduces reliance on extremely tight horizontal fin pitch alone. The vertical flow path provides an additional cooling mechanism, allowing for more relaxed fin pitch that is easier to manufacture while maintaining effective cooling through the combined vertical and horizontal coolant distribution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances cooling performance by reducing the junction temperature of silicon dies by an additional 15+°C for a 500 W TDP MCP package compared to traditional cold plates, while also reducing in-die temperature gradients by 40% and lowering manufacturing costs.
Implementation Method 1
a cold plate to which a silicon die is attached
Implementation Method 2
directing liquid flow perpendicular to the server package floor plan
Data Source
AI summary
Examples described herein relate to a cold plate. An example apparatus includes a first layer with one or more channels to receive fluid. The example apparatus further includes a second layer that is more rigid than the first layer. The second layer is to be mounted to the first layer and separated from the first layer by a gasket to reduce corrosion of the second layer.