Directly Coupled Heat Exchanger Cooling Assembly

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Solution Overview

Problem

Existing cooling systems for power electronics in electrified vehicles require extensive piping due to the separate placement of heat exchangers from heat-generating components, leading to increased material, labor, and energy costs, as well as spatial constraints.

Innovation Solution

A cooling assembly with a heat exchanger directly coupled to circuit board substrates, featuring an inlet and outlet plenum, and a pump, which reduces the need for piping by integrating the heat exchanger with the circuit board substrates, allowing for a compact and modular design.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the heat exchanger is positioned separately from the heat generating components, then the cooling system can access areas with lower air temperature for better heat dissipation, but the amount of piping required to route cooling fluid increases substantially

Engineering Contradiction:

Improveair temperature for heat dissipationVSAvoidamount of piping

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent integrates the heat exchanger directly with the circuit board substrate by coupling the substrate to the heat exchanger's inlet plenum and outlet plenum. This merging eliminates the need for separate piping to connect distant components, as the circuit board substrate itself serves as the fluid distribution manifold, thereby reducing piping complexity while maintaining effective heat dissipation.

Inventive Principle:

Principle #5Merging (Combining)

2Temperature

If the heat exchanger is positioned separately from the heat generating components, then spatial arrangement can be optimized for thermal performance, but material and labor costs increase due to extensive piping requirements

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmaterial and labor costs

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

By combining the heat exchanger with the circuit board substrate into a single integrated assembly, the patent eliminates the need for separate piping materials and reduces assembly labor. The circuit board substrate acts as both the electrical circuit carrier and the fluid distribution manifold, simplifying manufacturing while preserving thermal performance.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If the heat exchanger is positioned separately from the heat generating components, then cooling fluid can be routed through areas with favorable thermal conditions, but the overall system size and weight increase

Engineering Contradiction:

Improvecooling fluid temperature profileVSAvoidsystem weight

Core Design Contradiction:

TemperatureVSWeight of moving object

Solution Approach 1:

The integration of the heat exchanger with the circuit board substrate creates a compact assembly where the substrate serves dual functions as both electrical circuit support and fluid distribution manifold. This eliminates the weight of separate piping components while maintaining the ability to route cooling fluid through thermally favorable paths within the integrated structure.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration minimizes material and labor costs, enhances cooling capacity, and reduces energy requirements while maintaining effective heat dissipation from heat-generating components, making it suitable for applications with size and weight constraints.

Implementation Method 1

cooling fluid to be supplied to the at least one heat generating component... cooling fluid absorbs heat from the heat generating components

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

heat exchanger... dissipate heat to the surrounding air... relatively lower temperature air to pass over the cooling coils of the radiator

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS10562469B2Cooling assemblies for cooling heat generating components and vehicles and electronics assemblies incorporating the same

Publication Date: 2020.02.18 TOYOTA JIDOSHA KK

AI summary

An electronics assembly comprising at least one circuit board substrate comprising a fluid inlet channel and a fluid outlet channel and at least one heat generating component coupled to the circuit board substrate. The at least one heat generating component is fluidly coupled to the fluid inlet channel and the fluid outlet channel. A heat exchanger is directly coupled to the circuit board substrate and comprises an inlet plenum fluidly coupled to the fluid outlet channel of the circuit board substrate and an outlet plenum fluidly coupled to the inlet channel of the circuit board substrate. A pump is fluidly coupled to the circuit board substrate and the heat exchanger.