Power Element Assembly Structure With Segmented Heat Sinks

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The existing power element assembly structures have limited layout flexibility and poor heat dissipation capabilities due to the welding of heat sinks on the main board, which increases the board area and restricts the placement of components.

Innovation Solution

A power element assembly structure that includes a main board, a first heat sink, a second heat sink, an insulating support, an insulating thermally conductive layer, and a fixture, where the first heat sink is connected to the main board through the insulating support with a distance, allowing the power element to be fixed on the insulating thermally conductive layer and plugged into the main board, and the second heat sink is connected to the top surface of the first heat sink for enhanced heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the heat sink is welded on the main board, then the heat dissipation structure is simple and reliable, but the layout flexibility is low and the main board area is large

Engineering Contradiction:

Improveheat dissipation structure simplicityVSAvoidlayout flexibility

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The heat dissipation system is segmented into multiple heat sinks (first heat sink and second heat sink) that can be independently positioned and configured. The first heat sink is connected to the power element while the second heat sink receives heat from the first, allowing distributed heat dissipation across the main board. This segmentation enables flexible layout arrangements without requiring a single large welded heat sink structure.

Inventive Principle:

Principle #1Segmentation

2Reliability

If the heat sink is welded on the main board, then the heat dissipation path is direct, but the main board area increases and miniaturization is hindered

Engineering Contradiction:

Improveheat dissipation path efficiencyVSAvoidmain board area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The heat dissipation structure transitions from a planar welded configuration to a three-dimensional stacked arrangement. The first heat sink is positioned above the main board surface and connected to the power element, while the second heat sink is positioned above the first heat sink. This vertical stacking in the Z-dimension enables efficient heat dissipation paths without increasing the footprint area on the main board, facilitating miniaturization.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Volume of moving object

If the first heat sink is positioned close to the main board, then the structure is compact, but safety distance requirements are not met

Engineering Contradiction:

Improveassembly compactnessVSAvoidsafety distance compliance

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

An insulating support structure is introduced between the first heat sink and the main board to create an equipotential insulating barrier. This insulating support maintains a standardized safety distance while allowing the first heat sink to be positioned close to the main board in the vertical direction. The insulating support ensures electrical isolation and compliance with safety distance requirements without compromising assembly compactness.

Inventive Principle:

Principle #12Equipotentiality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves layout flexibility, reduces the main board area, and enhances heat dissipation capabilities, contributing to the miniaturization and reliability of the power element assembly structure.

Implementation Method 1

an insulating thermally conductive layer, and a fixture; where a first end of the insulating support is connected to the main board, a second end of the insulating support is connected to a bottom surface of the first heat sink

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

an insulating thermally conductive layer attached to a lateral surface of the first heat sink, the power element is attached to the insulating thermally conductive layer

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 3

heat generated by the power element during operation is transferred to the second heat sink through the first heat sink, to dissipate heat from the power element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 4

the fixture is an elastic sheet, the elastic sheet is connected to the first heat sink, and the power element is crimped to the first heat sink

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS20240357778A1Power element assembly structure

Publication Date: 2024.10.24 DELTA ELECTRONICS (SHANGHAI) CO LTD

AI summary

Provided is a power element assembly structure, including a main board, a first heat sink, a second heat sink, an insulating support, a power element, an insulating thermally conductive layer, and a fixture; where a first end of the insulating support is connected to the main board, a second end of the insulating support is connected to a bottom surface of the first heat sink, and there is a distance between the first heat sink and the main board, a top surface of the first heat sink is connected to the second heat sink; and the insulating thermally conductive layer is attached to a lateral surface of the first heat sink, the power element is attached to the insulating thermally conductive layer, and is fixed to the first heat sink by the fixture, and the power element is plugged on the main board.