Heat Conductor Substrate for Circuit Board Thermal Management
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Solution Overview
Problem
Current heat dissipation methods for distributed power units, such as those in communication base stations, face inefficiencies due to high thermal resistance, leading to localized high-temperature regions and reduced heat dissipation performance, especially for smaller devices that are far from heat sinks.
Innovation Solution
A heat dissipation apparatus featuring heat conductors disposed on a substrate with one end connected to the substrate and the other extending towards the circuit board, reducing thermal conduction resistance and enhancing heat transfer efficiency by creating a channel with low thermal resistance between heating elements and the substrate, and optionally using a thermally conductive potting compound and insulation layers to further improve heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks are used for heat dissipation in distributed power units, then heat can be dissipated into the external environment, but thermal resistance increases and localized high-temperature regions form when devices are far from heat sinks
Solution Approach 1:
The patent introduces a heat conductor as an intermediary component between the heating element and the substrate. This heat conductor acts as a thermal bridge that facilitates heat transfer from the heating element to the substrate, reducing thermal resistance and preventing localized high-temperature regions when devices are positioned away from heat sinks.
Solution Approach 2:
The patent extends the heat conductor in the vertical dimension from the substrate surface toward the heating element. This dimensional extension creates a direct thermal pathway through the space between the substrate and the heating element, enabling efficient heat dissipation without requiring the heating element to be in direct contact with the substrate or heat sink.
2Loss of energy
If heat is transferred through air from small devices to heat sinks, then heat dissipation is achieved, but thermal resistance becomes large and heat dissipation efficiency decreases
Solution Approach 1:
The patent replaces the air-based thermal conduction mechanism with a solid heat conductor. Air has low thermal conductivity, creating high thermal resistance. By substituting air with a heat conductor material that has high thermal conductivity, the patent creates an efficient thermal pathway that significantly reduces thermal resistance and improves heat dissipation efficiency.
3Adaptability or versatility
If heating elements are positioned away from the substrate, then device layout flexibility increases, but thermal conduction resistance increases and heat dissipation efficiency decreases
Solution Approach 1:
The heat conductor serves as a mediator that bridges the thermal gap created by positioning heating elements away from the substrate. This intermediary component maintains low thermal conduction resistance even when the heating element is positioned at a distance from the substrate, thereby preserving both layout flexibility and heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces thermal conduction resistance and improves heat dissipation efficiency, preventing overheating and extending the service life of electronic devices by rapidly transferring heat from heating elements to the substrate and dissipating it into the environment.
Implementation Method 1
Heat of each heating element, for example, a heating element relatively far away from the substrate, can be rapidly transferred to the substrate by using the heat conductor with relatively small thermal resistance
Implementation Method 2
Heat of each heating element, for example, a heating element relatively far away from the substrate, can be rapidly transferred to the substrate by using the heat conductor with relatively small thermal resistance, and then is dissipated from the substrate into an external environment
Data Source
Figure 1~2
Figure 3~3a
Figure 3b~3c
AI summary
Embodiments of this application provide a heat dissipation apparatus, a circuit board assembly, and an electronic device. The heat dissipation apparatus is applicable to a circuit board, where a plurality of heating elements are disposed on the circuit board, the heat dissipation apparatus includes a substrate, at least one heat conductor is disposed on one surface that is of the substrate and that faces the circuit board, one end of the heat conductor is connected to the substrate, and the other end extends toward the circuit board and is close to the heating elements. At least one heat conductor is disposed on the one surface that is of the substrate and that faces the circuit board, one end of the heat conductor is connected to the substrate, and the other end of the heat conductor extends toward the circuit board and is close to the heating elements. In this case, heat generated by each heating element can be rapidly transferred to the substrate by using the heat conductor with relatively small thermal resistance, and then is dissipated into an external environment from the substrate. This effectively reduces thermal conduction resistance from the heating element to the substrate, and improves heat dissipation efficiency of the heat dissipation apparatus.