Coplanar Micro-Lens Chip Packaging for Shared Focal Plane Alignment
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Solution Overview
Problem
Current multi-die stack packaging technologies face challenges in achieving optimal optical performance for multiple parallel image sensing elements due to differences in focal planes, leading to reduced optical performance in integrated circuit products with optical sensing functions.
Innovation Solution
A package structure and manufacturing method that encapsulates micro-lens chips in a coplanar control layer, ensuring that the lens, connection, and terminal surfaces of the micro-lens chips are coplanar, thereby maintaining a common focal plane and enhancing optical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple micro-lens chips are arranged in parallel in a multi-die stack packaging structure, then the integration of multiple image sensing elements is achieved, but the focal planes of the chips are not aligned, resulting in degraded optical performance
Solution Approach 1:
A coplanar control layer is introduced as an intermediary component between the substrate and the micro-lens chips. This layer includes a planarization structure that mediates the height differences of multiple micro-lens chips, enabling their surfaces to be coplanar and their focal planes to be aligned, thus resolving the focal plane alignment issue while maintaining multi-chip integration
Solution Approach 2:
The patent addresses the two-dimensional arrangement problem by introducing a vertical dimension solution through the coplanar control layer with planarization structure. This multi-layer vertical structure compensates for height variations in the horizontal arrangement, achieving coplanarity across multiple chips arranged in parallel
2Quantity of substance
If multiple micro-lens chips are arranged in parallel, then more image sensing elements are integrated, but height differences between chips increase, reducing optical performance
Solution Approach 1:
The coplanar control layer acts as a mediator that compensates for height differences between multiple micro-lens chips. The planarization structure within this layer provides a reference plane that enables chips at different heights to achieve coplanar surfaces, allowing more chips to be integrated without increasing height differences
Solution Approach 2:
The coplanar control layer is designed with different structural characteristics at different locations to accommodate chips with varying heights. The planarization structure provides localized compensation, allowing each chip region to achieve the required coplanarity while maintaining the overall multi-chip integration
Data Source
AI summary
A package structure and a manufacturing method thereof are provided. The package structure includes a plurality of micro-lens chips arranged at intervals and a coplanar control layer. The coplanar control layer is configured to encapsulate the plurality of micro-lens chips therein. At least one surface of each of the micro-lens chips is exposed outside the coplanar control layer, and the at least one surface of each of the micro-lens chips is coplanar.