Electrodeposited Copper Alloy Foil with Metal Oxide Dispersion
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Solution Overview
Problem
Conventional electrodeposited copper foils experience significant reduction in mechanical strength when heated to high temperatures due to the decomposition of organic additives incorporated in the grain boundaries, leading to thermal degradation and loss of structural integrity in applications requiring high temperature stability.
Innovation Solution
The development of an electrodeposited copper alloy foil with ultra-fine particles of metal oxides, such as tungsten, dispersed in a copper matrix, using a low chloride ion concentration electrolyte without organic additives, which maintains mechanical strength and electrical conductivity even at elevated temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional electrodeposited copper foil is heated to 300°C for lamination processing, then the polyimide layer can be formed, but the copper foil undergoes recrystallization and softening causing dimensional changes and warping
Solution Approach 1:
The patent changes the compositional parameters of the copper foil by adding specific alloying elements (Ti: 0.01-0.06 mass%, Mo: 0.01-0.06 mass%, W: 0.01-0.06 mass%) to modify the thermal behavior. These additions raise the recrystallization temperature and prevent excessive softening at 300°C, thereby maintaining dimensional stability during lamination processing.
Solution Approach 2:
The patent creates a composite copper alloy foil combining copper with multiple alloying elements (Ti, Mo, W) in specific proportions. This composite structure leverages the high melting points and thermal stability of these elements to resist thermal softening and maintain structural integrity during heat treatment, preventing warping while enabling conventional lamination processes.
2Manufacturing precision
If rolled copper alloy foil is used to maintain dimensional stability at 300°C, then warping is prevented, but the mechanical strength and elongation are reduced
Solution Approach 1:
The patent optimizes the compositional parameters by controlling the content of alloying elements within specific ranges (0.01-0.06 mass% each for Ti, Mo, W). This parameter optimization ensures that the copper alloy maintains both dimensional stability at 300°C and adequate mechanical strength, avoiding the excessive strength loss associated with conventional rolled copper alloys.
Solution Approach 2:
The patent applies local quality enhancement by incorporating specific alloying elements that provide targeted functional benefits: Ti and Mo for thermal stability, and W for strength retention. The controlled distribution of these elements creates localized regions of enhanced property that collectively achieve both dimensional stability and mechanical strength.
3Strength
If electrodeposited copper foil with high mechanical strength is used, then the foil can withstand processing loads, but the mechanical strength is significantly reduced when heated to high temperatures due to organic additive decomposition
Solution Approach 1:
The patent extracts and eliminates the harmful organic additives from the electrolyte composition. By using an inorganic electrolyte system without organic additives, the foil achieves high mechanical strength through controlled electrodeposition while avoiding the thermal degradation issue caused by organic additive decomposition at elevated temperatures.
Solution Approach 2:
The patent changes the chemical composition parameters by using an inorganic electrolyte system with specific metal salts (CuSO4, H2SO4, and alloying element salts) instead of organic-based electrolytes. This parameter change enables the deposition of a foil with high mechanical strength that maintains its properties at high temperatures, as inorganic compounds remain stable where organics decompose.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copper alloy foil exhibits high tensile strength and heat resistance, with minimal thermal degradation, making it suitable for applications like flexible printed wiring boards and lithium ion secondary battery negative electrode current collectors, where high mechanical strength is required after heat treatment.
Implementation Method 1
electrodeposited copper alloy foil
Implementation Method 2
electrolyte solution containing copper sulfate and metal salt
Implementation Method 3
ultra-fine particles of metal oxides, such as tungsten, dispersed in a copper matrix
Implementation Method 4
low chloride ion concentration electrolyte
Data Source
AI summary
Task: To provide an electrodeposited copper alloy foil with large mechanical strength under normal conditions, and that does not easily degrade due to heat when heated to about 300° C.Resolution Means: An electrodeposited copper alloy foil that includes a metal that exists as an oxide in a solution at pH4 or less or an oxide of the metal, and a method of manufacturing same.