Incorporating yttria or alumina precursors into the electrolyte during electroforming raises operating temperatures beyond 650 C without dispersants.
An inner diffusion barrier layer limits mutual solubility to stop crack propagation into the nickel-based superalloy component.
Carbon particle dispersion in sulfonic-acid silver baths creates durable composite plating films that eliminate cyanide use and reduce friction.
Replacing hard chrome with cobalt-phosphorous electrocomposites eliminates carcinogenic hexavalent chromium while preventing fatigue debit in the base material.
Electrochemically deposited indium composites disperse ceramic particles to achieve high thermal conductivity while eliminating air bubbles and voids.
Dispersion of functionalized diamond nanoparticles in metal ion fluid creates a composite coating that withstands elevated temperatures and high loads.
A flat surface metal inverse opal structure forms a porous bonding layer via particle removal to enable mechanical compliance and thermal conduction.
Electrodeposited copper alloy foil disperses ultra-fine metal oxide particles within the metallic matrix to enhance structural integrity.
Selenium ions in the plating bath adjust the silver matrix orientation, preventing wear resistance deterioration at high current densities.
Embedding silicon particles in a non-alloying metal matrix prevents pulverization during charge cycles, maintaining structural integrity and capacity retention.
Electrolytic plating films with dispersed glass particles form external electrodes, preventing blister formation during heat treatment.
Diamond grain plating increases gripping force to reduce pinching load and ensure stable tissue contact.
A metal matrix composite embeds hydrophobic nanoparticles to promote dropwise condensation.