Flat Surface Metal Inverse Opal Structure for Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional bonding and cooling structures for electronic assemblies face challenges in managing high heat flux and thermally-induced stresses due to coefficient of thermal expansion mismatch, with brittle bonding layers cracking and inadequate heat removal by conventional heat sinks, leading to thermal management issues.
Innovation Solution
A method for forming a flat surface metal inverse opal (MIO) structure by depositing metal onto particles on a substrate, applying an adhesive to expose particles, and removing them to create voids, resulting in a porous structure that enhances thermal management and mechanical compliance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional bonding layers are used to bond electronic devices to substrates, then bonding strength is achieved, but the brittle bonding layers crack due to CTE mismatch under thermal stress
Solution Approach 1:
The patent employs a porous metal bonding layer formed by depositing metal onto spherical particles arranged on a substrate, then removing the particles to create voids. This porous structure provides mechanical compliance and stress distribution, preventing crack propagation while maintaining bonding strength under thermal cycling conditions.
Solution Approach 2:
The bonding structure combines metal matrix with voids (porosity) to create a composite material system. The metal provides strength and thermal conductivity, while the voids provide compliance and stress relief, creating a composite that withstands CTE mismatch stresses better than solid metal layers.
2Temperature
If conventional heat sinks are used to remove heat from electronic assemblies, then some cooling is achieved, but substantial thermal resistance is introduced by additional bonding layers and thermal interface materials
Solution Approach 1:
The patent merges the bonding layer and heat sink functions into a single integrated porous metal structure. The same porous metal layer that provides mechanical bonding also serves as the thermal management interface, eliminating the need for separate bonding layers and thermal interface materials, thus reducing cumulative thermal resistance.
Solution Approach 2:
The porous metal bonding layer performs multiple functions simultaneously: mechanical bonding, stress relief, and thermal management. This multi-functional design eliminates the need for separate dedicated cooling components, reducing the number of interfaces and associated thermal resistance.
3Temperature
If additional bonding layers and thermal interface materials are added to achieve thermal management, then thermal coupling is improved, but the overall assembly complexity and thermal resistance increase
Solution Approach 1:
The porous metal bonding layer serves as a multi-functional component that simultaneously provides mechanical bonding, stress compliance, and thermal management capabilities. This eliminates the need for separate bonding layers and thermal interface materials, reducing assembly complexity while maintaining effective thermal coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The MIO structure effectively manages thermal expansion, reduces thermal resistance, and improves heat exchange, maintaining electronic assemblies within a suitable operating temperature range while minimizing packaging size, especially in high heat flux applications like vehicular electronics.
Implementation Method 1
A metal is then electrodeposited onto the plurality of polystyrene particles up to a desired level to form a metal layer
Implementation Method 2
each core-shell PC particle comprises a core comprising a phase change material (PCM) with a melting point between about 100° C. and about 250° C.
Data Source
AI summary
Embodiments of the disclosure relate to methods for forming a flat surface MIO structure for bonding and cooling electronic assemblies. In one embodiment, the method includes providing a plurality of particles on a surface of a base substrate. A metal is then deposited onto the plurality of particles up to a desired level to form a metal layer such that the plurality of particles is partially covered by the metal layer. An adhesive member is then applied to the plurality of particles exposed above the metal layer. Finally the adhesive member is pulled to remove individual particles of the plurality of particles that are exposed above the metal layer.