Gripping Tool Plating for Surgical Tissue Handling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional gripping tools used in neurosurgery and cardiac surgery face challenges in securely gripping small objects due to flat surfaces, leading to displacement and inadequate handling of delicate tissues, and existing methods of adhering ultra-hard grains result in uneven distribution and insufficient gripping force.
Innovation Solution
A plating processing method involving the use of diamond grains with specific grain diameters, where first diamond grains are temporarily fixed and then secured with a nickel layer, followed by the adherence of smaller second diamond grains to enhance gripping force and distribution, resulting in a stable and even surface for improved tissue handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If a flat gripping surface is used, then the structure is simple and easy to manufacture, but the gripping force is insufficient and objects may displace
Solution Approach 1:
The gripping surface combines a metal substrate with adhered diamond grains to create a composite structure. The metal provides structural integrity while the diamond grains provide enhanced friction and gripping force, resolving the contradiction between simple structure and sufficient gripping force.
Solution Approach 2:
The invention applies diamond grains selectively to the gripping surface area where contact with the object occurs. This local enhancement of surface properties provides improved gripping force exactly where needed, without complicating the entire device structure.
2Force
If ultra-hard grains are adhered to the gripping surface, then the gripping force increases, but the distribution becomes uneven and gripping force remains insufficient
Solution Approach 1:
The invention changes the parameter of grain size distribution by using diamond grains with a specific average diameter of 10 μm or less. This parameter control ensures uniform distribution across the gripping surface while maintaining high gripping force through the fine, consistent grain size.
3Force
If the gripping surface is processed with diamond grains, then the gripping force increases significantly, but the manufacturing process becomes more complex
Solution Approach 1:
The invention replaces complex mechanical attachment methods (such as brazing or screwing) with a chemical adhesion process using electroplating or chemical vapor deposition. This substitution achieves uniform grain distribution and strong bonding while simplifying the manufacturing process through a more controllable, automated deposition method.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a significant increase in gripping force, reducing the pinching load required by up to one-third to one-tenth compared to unprocessed surfaces, while enhancing wear resistance and ensuring stable contact with both rigid and biological tissues.
Implementation Method 1
placing the gripping tool in a bottom of a first plating solution, which is an electroplating solution containing nickel ion as a main ingredient... and temporarily fixing the first diamond grains onto the gripping surface by depositing nickel on the gripping surface
Implementation Method 2
in a second plating solution that is an electroless plating solution that forms a nickel alloy film with autocatalysis... and adhering the first diamond grains onto the gripping surface by further depositing a metal containing nickel within the second plating solution
Data Source
AI summary
A plating processing method of a gripping surface of a gripping tool includes: temporarily and evenly fixing a plurality of first diamond grains having a uniform first grain diameter; adhering the first diamond grains by depositing a metal containing nickel on a gripping surface in a uniform thickness after the first diamond grains have been temporarily fixed; placing a plurality of second diamond grains having a second grain diameter on a metal surface of the gripping surface on which first diamond grains are not present; and adhering the second diamond grains by further depositing a metal containing nickel within a second plating solution on the metal surface in a uniform thickness that does not exceed the first diameter grain and the second diameter grain until a position relationship between the metal surface and the second diamond grains is not displaced even when the gripping tool is moved.


