Copper Alloy Sputtering Target Grain Control
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Solution Overview
Problem
High-definition TFT panels require increased productivity and film-forming rates during sputtering, which leads to a higher likelihood of abnormal discharge and particle generation due to cracking in Cu—Ca alloy sputtering targets, especially when using hot rolling and high power.
Innovation Solution
A copper alloy sputtering target with a composition of 0.3 to 1.7 mass % Ca and Cu, where Ca-segregated phases contain Cu-dispersed phases, suppressing cracking and abnormal discharge by controlling the average grain diameter of these phases to less than 10 μm and 6 μm respectively, thereby enhancing adhesiveness and reducing cracking during hot rolling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sputtering power is increased to improve film-forming rate and productivity, then productivity is improved, but abnormal discharge becomes more likely to occur
Solution Approach 1:
The invention changes the microstructural parameters of the sputtering target by controlling the grain diameter of Ca-segregated phases to less than 10 μm and incorporating Cu-dispersed phases within them. This parameter change in the material structure suppresses abnormal discharge even at high sputtering powers, enabling high film-forming rates without increased discharge occurrence.
Solution Approach 2:
The invention creates a composite microstructure where Cu-dispersed phases are incorporated within Ca-segregated phases. This composite structure at the micro level suppresses abnormal discharge during high-power sputtering, allowing high productivity without compromising reliability.
2Ease of manufacture
If hot rolling is used to manufacture Cu—Ca alloy sputtering targets, then manufacturing efficiency is improved, but cracking occurs in Ca-segregated phases
Solution Approach 1:
The invention changes the microstructural parameters by controlling the grain diameter of Ca-segregated phases to less than 10 μm and incorporating Cu-dispersed phases. This parameter control prevents cracking during hot rolling while maintaining manufacturing efficiency, as the fine-grained structure with dispersed Cu phases resists crack propagation.
Solution Approach 2:
The invention segments the Ca-segregated phases into fine grains with diameter less than 10 μm and further segments them by incorporating Cu-dispersed phases within them. This segmentation prevents crack propagation during hot rolling, maintaining both manufacturing efficiency and structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses abnormal discharge and particle generation even at higher sputtering powers, ensuring reliable film formation with improved adhesiveness to substrates and reduced cracking in plate materials, thus enhancing productivity and film quality.
Implementation Method 1
the present invention relates to a copper alloy sputtering target used as a target during sputtering when, for example, a copper alloy film serving as a wiring film
Data Source
AI summary
A copper alloy sputtering target is made of a copper alloy having a composition containing Ca in a range of 0.3 mass % to 1.7 mass % with a remainder of Cu and inevitable impurities, a Ca-segregated phase (10) in which Ca is segregated is dispersed in a matrix phase, and the Ca-segregated phase contains a Cu-dispersed phase (11) made of Cu.