Copper-Aluminum Clad Material With Controlled Layer Undulation
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Solution Overview
Problem
Existing clad materials with a three-layer structure (copper layer/aluminum layer/copper layer) face issues with thickness variation (undulation) leading to exposure of the aluminum layer, which corrodes due to natural potential differences, compromising weight reduction and electrical resistance when replacing pure copper with aluminum.
Innovation Solution
A clad material manufacturing method that controls the thickness ratios and undulation of copper and aluminum layers, ensuring 6≤TA/TC1≤26, 6≤TA/TC2≤26, and 1.0≤TC1MAX/TC1MIN≤3.0, 1.0≤TC2MAX/TC2MIN≤3.0, using specific aluminum alloys like A3000, A5000, or A6000 series, and rolling conditions to suppress undulation and maintain electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the thickness ratio of aluminum layer to copper layer (X) is increased to achieve weight reduction of 50% or more, then weight reduction is improved, but thickness variation (undulation) of copper layers occurs excessively causing aluminum layer exposure and corrosion
Solution Approach 1:
The patent applies parameter changes by optimizing the thickness ratio parameter X to be within 5-15, and controlling the undulation amount to be 0.01mm or less. By adjusting these parameters within specific ranges, the invention achieves weight reduction of 50% or more while preventing excessive undulation and aluminum layer exposure, thus resolving the contradiction between weight reduction and manufacturing precision.
Solution Approach 2:
The patent uses a composite clad material structure with copper layers and aluminum layer bonded together. This composite structure allows the material to combine the high conductivity of copper with the low density of aluminum, achieving weight reduction while maintaining electrical properties and controlling undulation through the composite layer interaction.
2Reliability
If the thickness of copper layers is increased to prevent aluminum layer exposure, then corrosion resistance is improved, but weight reduction effect decreases
Solution Approach 1:
The patent optimizes the copper layer thickness parameter TC1 and TC2 to be within 0.01-0.8mm, and controls the thickness ratio X to be 5-15. This parameter optimization ensures that the copper layers are thick enough to prevent aluminum exposure and corrosion, while keeping the overall weight reduced by using minimal necessary copper thickness.
Solution Approach 2:
The patent applies partial action by using thin copper layers (0.01-0.8mm) that are just sufficient to prevent aluminum exposure, rather than using thick copper layers. This partial coverage approach maintains corrosion resistance while minimizing weight, achieving the balance between reliability and weight reduction.
3Weight of moving object
If aluminum material is used to replace pure copper material, then weight reduction is achieved, but electrical resistance increases
Solution Approach 1:
The patent uses a composite clad material structure with copper layers (high conductivity) and aluminum layer (low density) bonded together. The copper layers with thickness TC1 and TC2 provide the necessary electrical conductivity path, while the aluminum layer contributes to weight reduction. This composite structure resolves the contradiction by combining materials with complementary properties.
Solution Approach 2:
The patent applies local quality by placing copper material specifically at the surfaces where electrical conduction is most critical, and aluminum material in the core where weight reduction is prioritized. This spatial distribution of material properties optimizes both electrical conductivity and weight reduction simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves a weight reduction of 50% or more compared to pure copper while maintaining low electrical resistance, suitable for conductors in electrical and electronic devices, particularly for alternating current applications.
Implementation Method 1
a first copper layer, an aluminum layer, and a second copper layer which are sequentially laminated and pressure-bonded
Implementation Method 2
manufacturing method that controls the thickness ratios and undulation of copper and aluminum layers, ensuring 6≤TA/TC1≤26, 6≤TA/TC2≤26, and 1.0≤TC1MAX/TC1MIN≤3.0, 1.0≤TC2MAX/TC2MIN≤3.0, using specific aluminum alloys like A3000, A5000, or A6000 series, and rolling conditions to suppress undulation
Data Source
AI summary
A clad material includes a first copper layer, an aluminum layer, and a second copper layer sequentially laminated and pressure-bonded. When an average total thickness is TP, an average layer thickness of the aluminum layer is TA, an average layer thickness of the first copper layer is TC1, a maximum layer thickness and a minimum layer thickness of the first copper layer in a measurement target range of the average layer thickness TC1 are TC1MAX and TC1MIN, an average layer thickness of the second copper layer is TC2, and a maximum layer thickness and a minimum layer thickness of the second copper layer in a measurement target range of the average layer thickness TC2 are TC2MAX and TC2MIN, the clad material satisfies 0.5 mm≤TP≤2.0 mm, 6≤TA/TC1≤26, 6≤TA/TC2≤26, 1.0≤TC1MAX/TC1MIN≤3.0, and 1.0≤TC2MAX/TC2MIN≤3.0.