Copper-Chromium Oxide Spinel Particle Control for Smooth LDS Plating
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Solution Overview
Problem
Existing copper-chromium oxide spinels lack controlled particle size distribution, leading to non-uniform dispersion in resin compositions, resulting in rough surfaces and variations in plating adhesion during laser direct structuring (LDS) processes.
Innovation Solution
A copper-chromium oxide spinel with a controlled particle size distribution, characterized by a SPAN=(D90-D10)/D50 of 2 or less, D50 of 5.0 μm or less, and D90 of 10.0 μm or less, with a preferred octahedral shape, and optionally containing molybdenum, sodium, or potassium, to enhance plating adhesion and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If commercially available metal oxides are used without controlling particle size distribution, then manufacturing cost is reduced, but uniform dispersion in resin is not achieved and surface roughness increases
Solution Approach 1:
The patent applies parameter changes by precisely controlling the particle size distribution parameters (SPAN≤2, D50≤5.0 μm, D90≤10.0 μm) of the copper-chromium oxide spinel. This parameter control enables uniform dispersion in the resin composition and prevents surface roughness, while maintaining cost-effectiveness through controlled synthesis rather than reliance on expensive pre-sorted commercial materials.
Solution Approach 2:
The patent creates a composite material system by combining copper oxide and chromium oxide in a specific molar ratio (Cu:Cr = 1:2) to form a copper-chromium oxide spinel structure. This composite approach achieves both uniform dispersion and surface smoothness while maintaining manufacturing efficiency through a single synthesis process.
2Device complexity
If particle size distribution is not controlled, then production process is simplified, but plating adhesion uniformity deteriorates
Solution Approach 1:
The patent controls the particle size distribution parameters (SPAN, D50, D90) to achieve uniform plating adhesion. By maintaining SPAN≤2 and D50≤5.0 μm, the synthesis process achieves consistent plating performance without requiring complex post-processing or sorting operations, thus balancing process simplicity with reliability.
3Quantity of substance
If coarse particles are present on the surface, then material utilization is increased, but surface roughness increases and plating adhesion varies
Solution Approach 1:
The patent严格控制 the upper limit of particle size (D90≤10.0 μm) to prevent coarse particles from forming on the surface. This parameter control ensures that all particles are small enough to achieve uniform dispersion and smooth surfaces, while maintaining efficient material utilization through complete incorporation of the spinel particles into the resin matrix.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The controlled particle size distribution ensures smooth resin surfaces and uniform plating adhesion, improving the quality and consistency of resin molded articles in LDS processes.
Implementation Method 1
if the particle size distribution is not controlled, a metal oxide is not uniformly dispersed in a resin
Implementation Method 2
when a laser is applied to a resin molded article containing a certain additive, and the surface of the part to which the laser has been applied is roughened and the additive is activated
Data Source
AI summary
Provided are a copper-chromium oxide spinel, and a resin composition and a resin molded article containing the copper-chromium oxide spinel. Specifically, provided is a copper-chromium oxide spinel with a particle size distribution spread SPAN=(D90−D10)/D50 of 2 or less where, in volume-converted particle size distribution obtained by a laser diffraction and scattering method, particle sizes with a cumulative frequency from a smaller particle size side of 10%, 50%, and 90% are D10, D50, and D90, respectively.