Copper Clad Laminate Adhesion via Phosphorus Surface Control
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Solution Overview
Problem
Existing copper clad laminates face challenges in achieving both strong adhesion and suitable dielectric properties for high-frequency applications, particularly due to issues with conductor loss and dielectric loss, as well as poor bonding between low-dielectric resins and copper foil.
Innovation Solution
A copper clad laminate is developed, comprising a copper foil with specific surface roughness and phosphorus content, an adhesive layer made of a non-perfluorinated resin, and a dielectric layer. The copper foil's first surface, which contacts the adhesive layer, has a ten-point average roughness (Rz) of less than 0.5 μm and a phosphorus content of no more than 499 μg/dm2.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If roughening treatment is applied to copper foil surface to enhance bonding, then adhesion strength is improved, but signal transmission path length increases causing higher conductor loss
Solution Approach 1:
The patent changes the chemical composition parameters of the copper foil by controlling phosphorus content (0.003-0.04 wt%) and introducing specific alloying elements (Fe: 0.003-0.03 wt%, Ti: 0.003-0.03 wt%, V: 0.003-0.03 wt%). This enables achieving adequate adhesion strength through chemical bonding mechanisms rather than relying on surface roughness, thereby maintaining smooth signal transmission path.
Solution Approach 2:
The patent replaces the mechanical anchoring effect (roughening treatment) with chemical bonding mechanisms. By controlling phosphorus content and alloy composition, chemical bonds form between the copper foil and adhesive layer, substituting the need for mechanical interlocking through surface roughness.
2Loss of energy
If surface roughness is reduced to decrease signal transmission path length, then conductor loss is reduced, but adhesion strength deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the copper foil by precisely controlling phosphorus content (0.003-0.04 wt%) and alloying element concentrations. This enables achieving strong adhesion through chemical bonding mechanisms rather than relying on surface roughness, allowing smooth surfaces to maintain both low conductor loss and high adhesion strength.
3Loss of energy
If low-dielectric resins are used to reduce dielectric loss, then dielectric loss is reduced, but bonding capability with copper foil deteriorates
Solution Approach 1:
The patent introduces phosphorus as a chemical intermediary at the copper foil surface (0.006-0.1 μg/dm²). This phosphorus layer acts as a mediator that enhances chemical bonding between the low-dielectric resin and copper foil, enabling low-dielectric materials to achieve both low dielectric loss and adequate bonding capability.
Solution Approach 2:
The patent changes the chemical composition parameters of the copper foil by controlling phosphorus content and alloying elements, which modifies the surface chemistry to improve bonding affinity with low-dielectric resins while maintaining their low dielectric loss properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copper clad laminate exhibits enhanced peeling strength, improved thermal resistance, and superior anti-aging properties, making it particularly suitable for high-frequency signal transmission.
Implementation Method 1
This results in reduced intermolecular force at the interface between the insulating resin substrate and copper foil, preventing the establishment of chemical bonding
Implementation Method 2
an adhesive layer which is disposed on at least one side of the dielectric layer and formed of an adhesive material, wherein the adhesive material comprises a non-perfluorinated resin
Data Source
AI summary
A copper clad laminate is provided. The copper clad laminate includes a dielectric layer; an adhesive layer, which is disposed on at least one side of the dielectric layer and formed of an adhesive material, wherein the adhesive material includes a non-perfluorinated resin; and a copper foil, wherein the copper foil has a first surface and is disposed on the other side of the adhesive layer opposite to the dielectric layer, and the copper foil is adhered to the adhesive layer with the first surface, wherein the first surface has a ten-point average roughness (Rz) of less than 0.5 μm, and the copper foil has a phosphorus content of no more than 499 μg/dm2 at the first surface.