Copper-Cobalt Coating for Solid Oxide Cell Interconnects
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Solution Overview
Problem
Current coatings for solid oxide cell (SOC) interconnects are expensive and inefficient, prone to chromium poisoning due to chromium diffusion, and lack effective protection against oxidation, with ceramic coatings having poor adhesion and metallic coatings being costly and complex to apply.
Innovation Solution
A method involving electrodeposition of a metallic cobalt layer followed by ion-exchange plating of copper on an interconnect substrate with Cr and Fe, forming a self-limiting copper-cobalt coating that acts as an effective barrier against chromium volatilization and oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic coatings are applied to protect against chromium poisoning, then protection against chromium diffusion is improved, but adhesion strength deteriorates
Solution Approach 1:
The invention uses a composite coating system consisting of a ceramic top layer (Mn-Co spinel) applied over a metallic intermediate layer (cobalt or nickel). This composite structure combines the chromium-poisoning resistance of ceramic materials with the superior adhesion properties of metallic coatings, resolving the contradiction between protection effectiveness and adhesion strength.
2Strength
If metallic coatings are used to improve adhesion, then adhesion strength is improved, but cost and manufacturing complexity increase
Solution Approach 1:
The coating process is segmented into distinct stages: first applying a metallic strike layer for adhesion, then applying the ceramic protective layer. This segmentation allows each layer to perform its specific function optimally while using standardized, industry-established deposition techniques for each material type.
Solution Approach 2:
The metallic strike layer is applied in advance as a preliminary step before applying the ceramic coating. This preliminary metallic layer prepares the substrate surface to ensure optimal adhesion of the subsequent ceramic layer, eliminating the need for complex surface treatments or primers.
3Quantity of substance
If thick copper layers are deposited by conventional electrodeposition, then copper coverage is improved, but cobalt contamination increases
Solution Approach 1:
A thin cobalt intermediate layer is introduced between the copper and the interconnect substrate. This intermediary layer acts as a barrier that prevents cobalt ions from the substrate from contaminating the copper layer during electrodeposition, while still allowing the copper to deposit uniformly to the desired thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides a cost-effective, scalable solution that significantly reduces chromium poisoning and oxidation of SOC interconnects, enhancing the durability and performance of SOC stacks by forming a strong, protective metallic copper-cobalt coating.
Implementation Method 1
coating the interconnect substrate with a first metallic layer by electrodeposition
Implementation Method 2
coating the resulting structure with a layer of metallic copper by ion-exchange plating
Data Source
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AI summary
A method for coating an interconnect for a solid oxide cell (SOC) stack comprises providing an interconnect substrate comprising Cr and Fe, coating the interconnect substrate with a first metallic layer by electrodeposition, coating the resulting structure with a second layer of metallic cobalt by electrodeposition and coating the resulting structure with a layer of metallic copper by ion-exchange plating. This way, a metallic copper-cobalt coating is formed on the interconnect.