Copper Display Substrate With Anti-Oxidation Layer for Mini LED Reliability
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Solution Overview
Problem
Current Mini LED/Micro LED display technologies face challenges in manufacturing due to oxidation issues with thick copper layers, which affect the reliability and longevity of the display substrates.
Innovation Solution
A display substrate design featuring a copper layer with a nickel-containing alloy anti-oxidation layer, where the copper layer thickness is greater than the anti-oxidation layer thickness, and a method for manufacturing this substrate involving electroplating and OSP processes to prevent oxidation and ensure reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick copper layer is used in Mini LED/Micro LED display substrates, then electrical conductivity and current carrying capacity are improved, but oxidation resistance deteriorates
Solution Approach 1:
An anti-oxidation layer is introduced as an intermediary between the copper layer and the external environment. This layer acts as a protective barrier that prevents oxygen from reaching and oxidizing the copper, while allowing the copper to maintain its electrical conductivity function. The anti-oxidation layer mediates between the need for thick copper (for conductivity) and the need for oxidation resistance.
Solution Approach 2:
The patent employs a composite structure consisting of multiple layers with different functions: a copper layer for electrical conductivity and an anti-oxidation layer for protection. This composite material approach combines the advantages of different materials - the high conductivity of copper with the oxidation resistance of the anti-oxidation layer - to create a structure that satisfies both requirements simultaneously.
2Object-affected harmful factors
If traditional electroless nickel immersion gold process is used, then oxidation protection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent replaces the expensive multi-layer electroless nickel immersion gold process with a simpler, more cost-effective anti-oxidation layer. This anti-oxidation layer provides sufficient protection against oxidation at a lower manufacturing cost, effectively substituting a complex expensive process with a simpler cheaper alternative that achieves the same protective function.
Solution Approach 2:
The patent changes the parameters of the protective layer structure - using a single anti-oxidation layer instead of multiple layers (nickel and gold). This parameter change simplifies the manufacturing process, reduces material costs, and maintains adequate oxidation protection, thereby resolving the contradiction between protection and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents copper oxidation, enhances the reliability of the display substrate by maintaining the copper layer's integrity, and reduces manufacturing costs by avoiding the electroless nickel immersion gold process.
Implementation Method 1
a metal layer on the base substrate, including a copper layer having a first thickness... the at least one electrode of the light emitting diode is electrically connected to the metal layer
Implementation Method 2
an anti-oxidation layer on a side of the metal layer away from the base substrate... effectively prevents copper oxidation
Implementation Method 3
a method for manufacturing the display substrate, including: depositing a copper seed layer on a base substrate; forming a copper layer on a part of the copper seed layer not covered by the photoresist pattern by using an electroplating process
Data Source
AI summary
A display substrate, a method for manufacturing the display substrate, and a display device are provided. The display substrate includes: a base substrate; a metal layer on the base substrate, including a copper layer having a first thickness; an anti-oxidation layer on a side of the metal layer away from the base substrate, having a second thickness; and a light emitting diode on a side of the anti-oxidation layer away from the base substrate, including at least one electrode electrically connected to the metal layer, where the first thickness of the metal layer is larger than the second thickness of the anti-oxidation layer.