Copper Etching Solution Using Maleic Acid and Copper Ions
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Solution Overview
Problem
Conventional etching solutions for copper-based wiring in display devices face issues such as high etching rates, corrosion, and safety hazards due to halide ions and hydrogen peroxide, and struggle with adhesion and diffusion problems, which affect the quality and reliability of copper-based wiring in display devices.
Innovation Solution
An etching solution containing a maleic acid ion source and a copper ion source, along with optional organic acid and pH adjustors, is used to control etching rates and prevent corrosion, ensuring stable and safe etching of copper-based materials without halide ions or hydrogen peroxide, suitable for multilayer structures like copper-molybdenum films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If an etching solution containing halide ions is used for copper, then the etching rate is high, but the apparatus suffers corrosion
Solution Approach 1:
The patent removes halide ions (the harmful component) from the etching solution while maintaining copper etching capability through alternative chemistry involving maleic acid and copper ions, thereby eliminating apparatus corrosion while preserving productivity
Solution Approach 2:
The patent converts the harmful effect of halide ions by replacing them with a benign system using maleic acid and copper ions that achieves the same etching function without causing corrosion to the apparatus
2Productivity
If an etching solution containing hydrogen peroxide is used for copper, then the etching process is effective, but gas or heat is generated causing breakage of the apparatus
Solution Approach 1:
The patent extracts hydrogen peroxide from the etching solution to eliminate the dangerous decomposition reaction that generates gas and heat, while maintaining etching effectiveness through the maleic acid-copper ion system
Solution Approach 2:
The patent replaces the hazardous hydrogen peroxide system with a safe maleic acid and copper ion system that provides the same etching function without generating dangerous gas or heat that could break the apparatus
3Productivity
If ammonia is used in the etching solution for copper, then the etching process works, but the reduction of ammonia concentration causes changes in etching rate and emitted ammonia worsens the working environment
Solution Approach 1:
The patent removes ammonia from the etching solution, replacing it with maleic acid and copper ions that provide etching functionality without producing harmful emissions that deteriorate the working environment
Solution Approach 2:
The patent changes the chemical parameters of the etching solution from an ammonia-based system to a maleic acid-copper ion system, fundamentally altering the chemistry to eliminate harmful emissions while maintaining etching effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable and controlled etching process for copper-based materials, preventing corrosion and residue formation, enabling high productivity and reliable etching of multilayer structures in display devices without safety hazards, and maintaining etching performance across varying concentrations and pH levels.
Implementation Method 1
an etching solution containing (A) a maleic acid ion source and (B) a copper ion source
Implementation Method 2
an organic acid ion source having two or more carboxyl groups and one or more hydroxyl groups per molecule
Data Source
AI summary
The present invention relates to an etching solution for copper or a compound comprised mainly of copper, wherein the etching solution contains (A) a maleic acid ion source and (B) a copper ion source, and an etching method using the etching solution.