Copper Foil Composite Structure With Stable Carrier Peeling
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Solution Overview
Problem
Current copper foil structures face issues with uneven distribution and peeling strength due to instability of the release layer, which affects separation from the carrier, particularly at high temperatures.
Innovation Solution
A copper-nitrogen composite layer is formed on a carrier through a co-plating process using a copper plating solution and nitrogen-containing compounds, enhancing stability and preventing bonding between copper atoms in subsequent processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a release layer is adopted in copper foil structures, then the copper foil can be formed on the carrier, but the peeling strength becomes unstable and uneven, making it difficult to separate the carrier from the copper foil at high temperatures
Solution Approach 1:
The patent changes the chemical composition parameters of the release layer by using a copper-nitrogen composite layer formed through co-plating with nitrogen-containing compounds (such as benzotriazole, 5-mercapto-1-phenyl-1H-tetrazole, or 3-amino-triazole). This chemical parameter change transforms the release layer from an unstable inorganic/organic combination to a stable composite structure that maintains consistent peeling strength across different temperatures, resolving the contradiction between ease of separation and peeling strength stability.
Solution Approach 2:
The patent creates a composite release layer by combining copper atoms with nitrogen-containing compounds during the electroplating process. This copper-nitrogen composite structure integrates the advantages of both components: the copper provides structural stability while the nitrogen-containing compound ensures stable peeling performance. The composite material approach eliminates the sagging and uneven distribution issues of conventional release layers, achieving both reliable peeling strength and ease of separation.
2Ease of manufacture
If an inorganic layer is used in the release layer, then the copper foil structure can be formed, but the inorganic layer is prone to sag during manufacturing, resulting in uneven distribution and uneven peeling strength
Solution Approach 1:
The patent changes the physical and chemical parameters of the release layer by employing a copper-nitrogen composite structure formed through controlled co-plating. The nitrogen-containing compounds (such as benzotriazole or 5-mercapto-1-phenyl-1H-tetrazole) act as additives that control the deposition behavior, preventing sagging and ensuring uniform distribution. This parameter change transforms the manufacturing process to achieve both ease of formation and high manufacturing precision regarding uniformity.
Solution Approach 2:
The nitrogen-containing compounds serve as intermediary substances during the electroplating process. These compounds mediate between the copper plating solution and the carrier surface, controlling the deposition rate and distribution of copper atoms. The intermediary action of nitrogen-containing compounds prevents inorganic layer sagging and ensures even distribution, resolving the contradiction between ease of formation and manufacturing precision.
3Ease of manufacture
If an organic layer is used in the release layer, then the copper foil can be formed, but the peeling strength increases at high temperatures, making it difficult to separate the carrier from the copper foil
Solution Approach 1:
The patent changes the thermal parameters of the release layer by using a copper-nitrogen composite structure instead of conventional organic-based release layers. The nitrogen-containing compounds (such as benzotriazole, 5-mercapto-1-phenyl-1H-tetrazole, or 3-amino-triazole) provide thermal stability that prevents the peeling strength from increasing excessively at high temperatures. This parameter change enables the release layer to maintain stable performance across temperature variations, resolving the contradiction between ease of formation and temperature stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copper-nitrogen composite layer improves peeling strength, allowing easier separation of the copper foil from the carrier, reduces manufacturing costs, and avoids issues like sagging and uneven distribution, while maintaining stability at various temperatures.
Implementation Method 1
performing a co-plating process through a copper plating solution and a nitrogen-containing compound to form a copper-nitrogen composite layer on the carrier
Data Source
AI summary
Disclosed is a manufacturing method of a copper foil composite structure, including providing a carrier; performing a co-plating process through a copper plating solution and a nitrogen-containing compound to form a copper-nitrogen composite layer on the carrier; and forming a copper foil layer on the copper-nitrogen composite layer. A copper foil composite structure is also disclosed.