Copper Foil Primer Composition for High-Frequency Circuit Boards
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Solution Overview
Problem
The development of substrates with low dielectric constant and loss is crucial for high-frequency circuit boards to maintain signal transmission quality, but existing materials fail to provide adequate adhesion and electrical performance.
Innovation Solution
A copper foil substrate is developed with a primer composition of hydrocarbon resin and a compound having three or more carbon-carbon double bonds, combined with a fluorinated polymer and silane layers, enhancing adhesion and maintaining electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional materials are used for substrate, then manufacturing is easier, but adhesion and electrical performance are insufficient
Solution Approach 1:
The patent applies composite materials by creating a multi-layer substrate structure consisting of copper foil, fluorinated polymer layer, silane layer, and primer layer. Each layer serves specific functions: the fluorinated polymer provides low dielectric properties, the silane layer enhances adhesion, and the primer composition (hydrocarbon resin with polyfunctional compounds) ensures strong bonding. This composite structure resolves the contradiction by achieving superior adhesion and electrical performance through material composition rather than simplifying the overall structure.
Solution Approach 2:
The patent applies local quality by optimizing each layer's composition and properties for its specific function. The fluorinated polymer layer is designed with specific dielectric properties for signal transmission, the silane layer is configured for maximum adhesion to copper foil, and the primer composition uses specific molar ratios (1:0.2 to 1:10) of hydrocarbon resin to polyfunctional compounds to achieve optimal bonding. This localized optimization of material properties at different positions resolves the contradiction between performance and complexity.
2Strength
If high pressing temperature is used to improve bonding, then adhesion is enhanced, but energy consumption and material degradation increase
Solution Approach 1:
The patent applies parameter changes by modifying the chemical composition parameters of the primer layer, specifically using a controlled molar ratio of hydrocarbon resin to compounds with three or more carbon-carbon double bonds (1:0.2 to 1:10). This compositional parameter optimization enables strong bonding at lower pressing temperatures, resolving the contradiction between bonding strength and energy consumption. The specific ratio ensures sufficient reactivity and adhesion without requiring excessive thermal energy.
Solution Approach 2:
The patent applies the intermediary principle by introducing the silane layer as a mediator between the copper foil and the fluorinated polymer layer. The silane layer acts as a chemical bridge that enhances interfacial adhesion, allowing for reduced pressing temperatures while maintaining strong bonding. This intermediary layer resolves the contradiction by providing a chemical bonding mechanism that is less dependent on high thermal energy.
3Speed
If wiring density is increased for high-frequency transmission, then transmission rate improves, but signal loss increases
Solution Approach 1:
The patent applies parameter changes by optimizing the dielectric properties of the fluorinated polymer layer, specifically controlling its dielectric constant and dielectric loss parameters. By selecting fluorinated polymers with optimized molecular structure and composition, the substrate achieves low dielectric loss and low dielectric constant, enabling high wiring density for increased transmission rate while minimizing signal loss through reduced dielectric absorption and heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate achieves improved high-frequency dielectric properties and tensile strength, with favorable bonding effects even at lower pressing temperatures.
Implementation Method 1
a mixture of a hydrocarbon resin and a compound having three or more carbon-carbon double bonds
Data Source
AI summary
A primer composition and a copper foil substrate using the same are provided. The primer composition includes a mixture of a hydrocarbon resin and a compound having three or more carbon-carbon double bonds, wherein a molar ratio of the hydrocarbon resin to the compound having three or more carbon-carbon double bonds is 1:0.2 to 1:10.