Copper Surface Formate Treatment for Oxidation and Corrosion Resistance
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Solution Overview
Problem
Current anti-corrosion methods for metallic copper-containing materials are either costly, complex, or ineffective in providing long-term oxidation resistance, especially in saline-alkali environments, limiting their application in industries such as electric power, machinery, and construction.
Innovation Solution
A method involving the use of formate compounds, specifically lithium, sodium, or other metal formates, as stabilizers in a polar solvent with organic amines, to treat copper-containing materials through a sealing and pressurizing reaction, which enhances oxidation resistance without compromising conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If surface plating with inert metal (gold, palladium, silver) is used, then oxidation resistance is improved, but cost increases and process complexity increases
Solution Approach 1:
The patent replaces expensive inert metal plating with a low-cost organic stabilizer treatment using amine, aldehyde, phenol, carboxylic acid or their derivatives. This cheap short-living organic coating provides sufficient oxidation protection for copper surfaces without the high cost and complexity of precious metal plating processes
Solution Approach 2:
The patent substitutes the mechanical/physical process of metal plating (vacuum vapor plating, chemical plating) with a chemical treatment process involving organic stabilizers. This replacement simplifies the equipment requirements and process complexity while achieving the desired oxidation resistance
2Reliability
If cathodic protection with sacrificial metal anode (tin, zinc plating) is used, then oxidation resistance is improved, but cost increases and process complexity increases
Solution Approach 1:
The patent replaces expensive sacrificial metal plating with inexpensive organic stabilizer treatment. The organic compounds form a protective layer on copper surfaces at low cost, eliminating the need for complex electroplating equipment and sacrificial anode materials
3Manufacturing precision
If acid pickling is used to remove oxide film, then surface cleanliness is improved, but copper powder oxidizes again and oxide film forms
Solution Approach 1:
The patent applies organic stabilizer treatment immediately after acid pickling to prevent re-oxidation. This preliminary protective action forms a stable organic layer on the freshly cleaned copper surface, preventing oxide film formation during subsequent handling and processing steps
Solution Approach 2:
The organic stabilizer acts as an intermediary between the acid-pickled copper surface and the oxidizing atmosphere. It forms a protective barrier that prevents direct contact between oxygen and the copper surface, eliminating the re-oxidation problem caused by acid pickling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method significantly improves the oxidation resistance and conductivity of copper-containing materials, including saline-alkali resistance, while being cost-effective and environmentally friendly, making it suitable for large-scale industrial use.
Implementation Method 1
The organic stabilizer may be an amine, an aldehyde, a phenol, a carboxylic acid and the like, which reduces the oxide film on the surfaces of the metallic copper-containing materials to metallic copper and inhibit the oxidation thereof
Implementation Method 2
addition of an appropriate amount of an organic stabilizer: the organic stabilizer may be an amine, an aldehyde, a phenol, a carboxylic acid and the like, which reduces the oxide film on the surfaces of the metallic copper-containing materials to metallic copper and inhibit the oxidation thereof
Data Source
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AI summary
An anticorrosion treatment method for a copper-containing material comprises: carrying out a sealed and pressurized reaction on a copper-containing material and a stabilizer in presence of a polar solvent and any assistant, the stabilizer being a compound capable of providing formates, so that the formates are adsorbed on the surface of the copper-containing material. In the method, formates are modified on the surface of the copper-containing material, accordingly, the oxidation resistance capability and the stability of the copper-containing material can be significantly improved while the electrical conductivity of the copper-containing material is not reduced, and the corrosion resistance of the copper-containing material and especially, the salt and alkali corrosion resistance of the copper-containing material are significantly improved.