Copper Laminate Antenna Assemblies for Faster AiP Manufacturing
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Solution Overview
Problem
Conventional Antenna-in-Package (AiP) manufacturing processes are expensive and slow, limiting the efficiency and cost-effectiveness of integrating antennas within wireless device packages.
Innovation Solution
The proposed method involves disposing a copper laminate onto a circuit board cover layer, forming intersecting isolation channels to define copper assemblies, and peeling off the remaining laminate to expose the adhesive layers, which are then treated to form permanent bonds between the copper assemblies and the cover layer, ultimately forming antenna assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional Antenna-in-Package (AiP) manufacturing processes are used, then antenna integration is achieved, but production cost and processing time increase significantly
Solution Approach 1:
The copper laminate is divided into multiple copper assemblies through isolation channels, allowing parallel processing and assembly. This segmentation enables simultaneous manufacturing of multiple antenna elements, increasing production rate while maintaining cost-effectiveness through standardized modular units
Solution Approach 2:
The adhesive layer is applied to the copper laminate before bonding to the cover layer, and the copper assemblies are pre-positioned on the circuit board. This preliminary action streamlines the manufacturing process by eliminating subsequent alignment and bonding steps, thereby increasing productivity without adding complexity
2Adaptability or versatility
If antenna integration is implemented in wireless device packages, then device functionality is enhanced, but manufacturing complexity increases
Solution Approach 1:
The copper laminate structure serves multiple functions: it provides the antenna elements, the adhesive bonding layer, and the structural support. This multi-functionality reduces the number of separate components and manufacturing steps, thereby enhancing device functionality without proportionally increasing manufacturing complexity
Solution Approach 2:
The copper assemblies are nested within the cover layer structure, with the adhesive layer bonding the copper to the cover. This nested arrangement integrates multiple functional elements (antenna, adhesive, structural support) into a compact unified structure, enhancing versatility while managing manufacturing complexity through hierarchical integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces raw material and processing costs while increasing production rates, providing a more efficient and cost-effective approach to manufacturing antenna assemblies for wireless devices.
Implementation Method 1
an adhesive layer bonding the antenna to the major top surface of the cover layer
Data Source
AI summary
An electronic assembly includes a circuit board including a plurality of electrically conductive traces, a cover layer disposed on the circuit board, and a plurality of antenna assemblies disposed on a major top surface of the cover layer and exposing the major top surface therebetween. Each of the antenna assemblies includes an antenna and an adhesive layer bonding the antenna to the major top surface of the cover layer. The antenna is electrically coupled to a corresponding different trace in the plurality of traces. The adhesive layers in the antenna assemblies have substantially a same first composition and a same average first thickness. The antennas in the antenna assemblies have substantially a same second composition and a same average second thickness greater than about 5 microns. The electronic assembly can be singulated to provide antenna assemblies. Methods of making the assemblies are also described.