A stacked metal PCB sub-board and clamshell layout improve MIMO antenna heat dissipation, impedance matching, and signal isolation.
Cross-linked coupling lines synchronize terahertz oscillators across an antenna array, improving phase matching, gain, and directivity.
A single wraparound film covers antenna surfaces and edges to block water ingress while reducing peeling from thermal expansion.
A radiation pattern shaping mechanism reduces central radiation and broadens beamwidth to keep phased array gain stable at wide scan angles.
Voltage difference monitoring across two insulating elements detects insulation deterioration early and can stop transmission before failure.
Dummy patterns visually blend transparent resonant elements while preserving electromagnetic reflection or transmission control.
A coupler splits input signals into I/Q paths, and a transistor multiplexer delivers precise 90-degree shifting with lower loss and power.
Dual-polarized UWB antenna modules use a ground-plane opening structure to improve EV position and orientation detection for wireless charging.
Phase conversion across segmented aperture elements steers beams toward targets and places nulls on interference to improve link reliability.
An air cavity inside a multilayer waveguide cuts dielectric loss, supports high-frequency signals, and reduces dependence on external materials.
A spacer layer and magnetic sheet help a metal-mount RFID tag avoid eddy current loss and maintain stable UHF communication.
Capacitive coupling, grounded shielding, and baluns keep nearby antennas isolated while reducing antenna size and loss.
A transparent metasurface on glass or substrate restores mmWave resonance and antenna gain while reducing glass-induced blocking and reflection.
Isolation-channel copper laminate processing forms bonded antenna assemblies faster while cutting AiP material and processing costs.
Direct thermal contact with the amplifying circuit stabilizes antenna temperature and prevents phase shifter drift, loss, and beam errors.
Photomask copper segmentation keeps wet etching uniform along transmission paths, reducing impedance variation across boards on one panel.
An airgap-coupled metal plate antenna reduces substrate-related loss and permittivity variation, helping stabilize 28GHz performance at lower cost.
A branched microstrip electrode layout cuts lead inductance and resistance, enabling larger microwave phase shift through stronger capacitance change.