MIMO Antenna Sub-Board Layout for Heat Dissipation and Signal Isolation
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Solution Overview
Problem
Existing multi-input and multi-output antenna systems face inefficiencies in heat dissipation due to low thermal conductivity of substrate materials and limited contact areas, leading to degraded heat dissipation and signal interference.
Innovation Solution
A multi-input and multi-output antenna apparatus is designed with a sub-board stacked on the rear surface of the main board, featuring heating elements on both surfaces to increase ground contact area and impedance matching, and incorporates a clamshell part to isolate signal paths and enhance heat dissipation through a metal PCB sub-board and heat sink fins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heating elements are mounted on the front surface of the PBA and heat is dissipated through via holes, then heat dissipation structure is provided, but heat dissipation efficiency is low due to small contact area between heating element and via holes
Solution Approach 1:
The patent transitions from dissipating heat through the thickness direction (via holes) to dissipating heat in the planar direction (rear surface of PBA). The heating element is positioned to contact both the front surface (mounting surface) and rear surface (heat dissipation surface) of the PBA, creating a three-dimensional heat dissipation path that increases contact area and improves efficiency.
Solution Approach 2:
The patent separates the heating element into multiple contact points with the PBA - one contact point on the front surface for mounting and additional contact points on the rear surface for heat dissipation. This segmentation of the heating element's contact interface increases the total contact area with the PBA, thereby improving heat dissipation efficiency.
2Temperature
If heat transfer coins are installed at via hole positions, then heat dissipation path is provided, but heat dissipation effect is degraded by contact tolerance of contact surface with heating element
Solution Approach 1:
The patent eliminates the need for precise contact between heat transfer coins and heating elements by providing direct heat dissipation through the rear surface of the PBA. The heating element's rear surface contacts the PBA's rear surface over a larger area, reducing sensitivity to contact tolerance issues.
Solution Approach 2:
The PBA itself serves as the intermediary heat transfer medium between the heating element and the external environment. By utilizing the PBA's rear surface as a heat dissipation interface, the patent creates a more reliable thermal pathway that is less dependent on precise alignment and contact between separate components.
3Adaptability or versatility
If multiple substrates are stacked in the main housing, then MIMO antenna structure is formed, but large amount of driving heat is generated in the main housing
Solution Approach 1:
The patent extracts the heat dissipation function from the internal substrate structure and provides a dedicated heat dissipation path through the rear surface of the PBA. By separating the heat dissipation function into a distinct pathway (through via holes to the rear surface), the patent enables effective heat management while maintaining the multi-substrate MIMO antenna structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation performance, reduces signal interference, and enhances filter performance by efficiently dissipating heat generated by RF elements and filters to the rear side of the main housing.
Implementation Method 1
heat generated from an RF element and heat generated from an RF filter to a rear side of a main housing
Implementation Method 2
heat dissipation performance by efficiently dissipating heat generated from an RF element and heat generated from an RF filter to a rear side of a main housing
Implementation Method 3
dissipating heat generated from an RF element and heat generated from an RF filter to a rear side of a main housing
Data Source
AI summary
The present invention relates to relates to a multi-input and multi-output antenna apparatus, and particularly, to a multi-input and multi-output antenna apparatus including a main board having an accommodation space formed in at least one region and provided in the form of a predetermined space, and a sub-board stacked on a rear surface portion of the main board and configured such that a plurality of heating elements is mounted on a front surface portion of the sub-board that is directed toward the accommodation space, in which heat generated from the heating elements is dissipated to a rear surface portion of the sub-board, which makes it possible to improve heat dissipation performance of the antenna apparatus and improve frequency filtering performance of the antenna apparatus.