Copper Microchannel Cooler for Integrated Circuits
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Solution Overview
Problem
Conventional cooling methods for integrated circuits face challenges in heat removal due to increased power density and geometric scaling, with silicon microchannel cooling being limited by material weakness, high fabrication costs, and non-uniform flow distribution.
Innovation Solution
A copper microchannel cooling apparatus with a unitary construction featuring a channel portion with tapered fins, a manifold portion, and a separator sheet, which improves fluid distribution and reduces pressure drop by allowing partial fin removal under inlet/outlet manifolds, enhancing thermal performance and flow uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If silicon microchannel cooling is used, then cooling capability is provided, but the structure is weak and fabrication is expensive
Solution Approach 1:
The patent changes the material parameter from silicon to copper, which has superior mechanical strength and thermal conductivity. This material substitution resolves the contradiction by providing both the required cooling capability and structural strength without the limitations of silicon construction
Solution Approach 2:
The patent employs copper which is more cost-effective to fabricate compared to silicon microchannel structures. The unitary construction method reduces manufacturing complexity and cost, making the cooling apparatus more economically viable while maintaining effective heat removal
2Quantity of substance
If conventional manifold design is used, then fluid distribution is provided, but pressure drops and non-uniform flow distribution occur
Solution Approach 1:
The patent segments the manifold into multiple distribution channels that independently feed the microchannels. This segmentation allows for more uniform flow distribution across all microchannels and reduces pressure drops by creating multiple parallel flow paths rather than a single concentrated manifold structure
Solution Approach 2:
The patent implements local quality by positioning distribution channels at specific locations above the active cooled portion, and inlet/outlet channels above the separator sheet. This strategic placement optimizes flow distribution to where it is most needed while minimizing unnecessary pressure drops in non-critical areas
3Productivity
If chip geometry is scaled down and operating speeds are increased, then system performance is improved, but power density increases making heat removal more difficult
Solution Approach 1:
The patent employs liquid cooling through microchannels instead of air cooling. The hydraulic flow of liquid coolant through the copper microchannels provides significantly higher heat transfer coefficients, enabling effective heat removal from high power density chips that cannot be cooled by conventional air cooling methods
Solution Approach 2:
The patent uses copper material which combines excellent thermal conductivity with high mechanical strength. This composite property allows the cooling apparatus to handle the increased heat flux from scaled-down, high-performance chips while maintaining structural integrity under operational conditions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copper microchannel cooling apparatus effectively addresses the limitations of silicon cooling by providing improved thermal conductivity and uniform flow distribution, reducing pressure drop and enhancing heat transfer efficiency.
Implementation Method 1
copper microchannel cooling apparatus and structures for cooling integrated circuits
Implementation Method 2
circulating cooling fluid needs to be small enough to achieve sufficient cooling of the chip
Data Source
AI summary
A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.