Copper MOD Ink Composition for Low-Temperature Conductive Films

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Solution Overview

Problem

Existing additive manufacturing techniques for radiofrequency electronics face challenges with copper nanostructured inks due to ambient condition oxidation and the need for high sintering conditions, which are costly and environmentally harmful, lacking mechanical and thermal stability.

Innovation Solution

A metallic MOD ink composition comprising a transition metal-formate salt, such as copper (II) formate, is mixed with solvents like di-ethylene glycol butyl ether and dimethylformamide, processed into small particles, and sintered at optimal temperatures to form a conductive layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If copper nanostructured inks are used for additive manufacturing, then electrical conductivity is improved, but mechanical and thermal stability deteriorates due to ambient oxidation

Engineering Contradiction:

Improveelectrical conductivityVSAvoidmechanical and thermal stability

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent uses organic precursors (metal carboxylates, metal alkoxides, metal acetylacetonates) as intermediary compounds that decompose during sintering to form copper metal. These precursors act as mediators between the starting materials and final copper conductors, enabling low-temperature processing while maintaining stability. The organic ligands provide steric protection and control decomposition pathways, preventing oxidation and enabling formation of stable copper films at reduced temperatures.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the chemical parameters of the ink composition by using metal organic precursors instead of traditional copper salts or nanostructured copper. This parameter change allows decomposition at lower temperatures (200-400°C) compared to conventional sintering, while the organic ligands control the decomposition kinetics and prevent oxidation, simultaneously achieving good conductivity and thermal stability.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If high sintering conditions are used to achieve high electrical conductivity, then conductivity is improved, but manufacturing cost and environmental harm increase

Engineering Contradiction:

Improveelectrical conductivityVSAvoidmanufacturing cost and environmental impact

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the chemical composition parameters by introducing metal organic precursors with controlled decomposition temperatures. This allows sintering at 200-400°C instead of conventional high-temperature processing (>800°C), significantly reducing energy consumption and manufacturing costs while maintaining high electrical conductivity. The organic ligands enable this parameter change by providing controlled decomposition pathways.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces the conventional thermal-mechanical sintering process with a chemical decomposition process. Instead of relying on high-temperature thermal energy to fuse copper particles, the organic precursors decompose chemically at lower temperatures to form copper metal in situ, substituting the mechanical sintering mechanism with a chemical transformation mechanism that is more energy-efficient and environmentally friendly.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If conventional subtractive manufacturing techniques are used, then manufacturing precision is maintained, but material waste and toxic chemical use increase

Engineering Contradiction:

Improveconductor qualityVSAvoidmaterial waste and chemical waste

Core Design Contradiction:

Manufacturing precisionVSLoss of substance

Solution Approach 1:

The patent inverts the conventional subtractive manufacturing approach by using additive manufacturing with metal organic precursors. Instead of starting with bulk copper and removing material through etching and patterning, the copper is deposited directly in the desired pattern through precursor decomposition. This inversion eliminates the need for toxic etchants and reduces material waste to minimal ink deposition, while maintaining precision through controlled printing and sintering processes.

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides highly conductive, mechanically and thermally stable copper films with improved electrical conductivity and electromagnetic interference shielding, suitable for flexible and wearable electronics.

Implementation Method 1

Methodology Applied

Scientific EffectThermal decomposition: Pyrolysis

Implementation Method 2

processed into small particles, and sintered at optimal temperatures to form a conductive layer

Methodology Applied

Scientific EffectSintering: Sintering

Data Source

PatentUS20250250453A1Systems, Devices, and Methods for Making and Using Printable Copper-Based Metal and Intermetallic Ink Materials

Publication Date: 2025.08.07 UNIV OF MARYLAND

AI summary

This present disclosure is directed to systems, devices, and methods of making printable copper and its alloy ink materials for materials such as printable electronics.