A twisted Fe-Co magnetic wire with fine α/γ microstructure and high-angle grain boundaries reduces Barkhausen variation while supporting smaller sensors.
By balancing Sn, Ni, P, and S to form nickel phosphides and sulfides, this alloy cuts lead while preserving connector strength and conductivity.
Laser ablation in a reel-to-reel FFC process enables variable trace widths and pad openings while reducing waste and improving connector fit.
Metal-organic copper ink enables low-temperature sintering into conductive films while limiting oxidation and improving thermal stability.
Minimal-solvent epoxy with plate-shaped silver particles improves storage stability while keeping cured connection resistance low.
A beryllium-free Cu-Ni-Si alloy uses cold work, solution annealing, and aging to reach high yield strength with 48% IACS conductivity.
An LCP blend with inorganic particles and epoxy-functionalized olefin copolymer improves ductility and impact strength while maintaining heat stability.
A diffusion-bonded copper sheath over a steel core cuts copper use while preserving electro-thermal capacity, break load, and service life.
A movable light-transmitting membrane stabilizes the immersion interface, protects objectives from contamination, and preserves working distance.
A fused aromatic polymer with tailored side chains improves charge mobility and solubility for flexible organic thin-film transistors.
A PEDOT:PSS coating dissipates charge in MIBI samples, improving signal uniformity while avoiding the background noise of metal layers.
Soft doped conductive elastomers lower skin contact impedance while preserving conductivity and stretchability for wearable biopotential sensing.
Varying ester substituents and aryl groups in benzo[dithiophene] polymers lifts organic photovoltaic efficiency beyond moderate levels.
A water-based cable coating cuts friction and pulling force during installation while preserving insulation properties and avoiding solvents.