Copper Oxide Solid Pellet for Plating Solution Replenishment

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Solution Overview

Problem

Copper plating solutions face challenges in maintaining copper ion concentrations due to the dispersion of copper oxide powder, leading to contamination in clean rooms and inconsistent plating quality.

Innovation Solution

A copper oxide solid is created by combining copper oxide powder with a liquid binder, which is then compression-molded and designed to have a concavo-convex shape, allowing it to be dissolved in the plating solution without dispersing, using an apparatus with a feeding mechanism and agitator to ensure uniform dissolution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If copper oxide powder is supplied into the plating solution, then the copper ion concentration is replenished, but fine particles increase and cause surface defects on the plated substrate

Engineering Contradiction:

Improvecopper ion concentrationVSAvoidsurface quality of plated substrate

Core Design Contradiction:

Quantity of substanceVSManufacturing precision

Solution Approach 1:

The copper oxide is divided into small particles (average 10-200 micrometers) to increase dissolution surface area, but these particles are then bound together into a solid pellet form. This segmentation allows controlled dissolution while preventing fine particle dispersion that would cause surface defects.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention creates a composite structure by combining copper oxide particles with a binder material to form a solid pellet. This composite material maintains the copper oxide's ability to replenish copper ions while the binder holds the particles together, preventing them from dispersing as fine contaminants in the plating solution.

Inventive Principle:

Principle #40Composite materials

2Quantity of substance

If copper oxide powder is dispersed in the plating solution, then copper ions are replenished, but contamination occurs in the clean room environment

Engineering Contradiction:

Improvecopper ion concentrationVSAvoidcontamination in clean room

Core Design Contradiction:

Quantity of substanceVSObject-generated harmful factors

Solution Approach 1:

The copper oxide is segmented into small particles (average 10-200 micrometers) to increase dissolution surface area, but these particles are then bound together into a solid pellet form. This segmentation allows controlled dissolution while preventing fine particle dispersion that would cause surface defects.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Inventive Principle:

Principle #40Composite materials

3Object-generated harmful factors

If a liquid binder is added to copper oxide powder to form a solid, then the copper oxide can be supplied without dispersing, but the dissolution rate may be affected

Engineering Contradiction:

Improveparticle dispersionVSAvoiddissolution rate

Core Design Contradiction:

Object-generated harmful factorsVSSpeed

Solution Approach 1:

The binder is applied locally to bind the copper oxide particles together into a solid pellet structure, rather than uniformly throughout. This localized binding maintains the external solid form for easy handling while preserving the internal particle structure's ability to dissolve. The concavo-convex surface pattern creates local variations that enhance dissolution.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The solid copper oxide is formed with a concavo-convex surface pattern featuring curved surfaces. This curvature increases the surface area for dissolution compared to a flat surface, while the solid pellet form prevents particle dispersion. The curved geometry promotes uniform dissolution rates.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The copper oxide solid effectively maintains copper ion concentrations in the plating solution, preventing contamination and ensuring consistent plating quality by dissolving uniformly and reliably, thus enhancing the efficiency of the plating process.

Implementation Method 1

a copper oxide solid to be supplied into a plating solution... comprising: a copper oxide powder; and a liquid as a binder to solidify the copper oxide powder

Methodology Applied

Scientific EffectDissolution: Solvation

Implementation Method 2

an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank

Methodology Applied

Scientific EffectAgitation: Stirring

Data Source

PatentUS11781233B2Copper oxide solid for use in plating of a substrate, method of producing the copper oxide solid, and apparatus for supplying a plating solution into a plating tank

Publication Date: 2023.10.10 EBARA CORP

AI summary

The present invention relates to a copper oxide solid for use in plating of a substrate using an insoluble anode. Further the present invention relates to a method of producing the copper oxide solid. Further the present invention relates to an apparatus for supplying a plating solution in which the copper oxide solid is dissolved into a plating tank. A copper oxide solid (CS) to be supplied into a plating solution for plating a substrate (W) includes a copper oxide powder and a liquid as a binder to solidify the copper oxide powder.