Copper Conductive Paste for Thin MLCC Electrode Coverage

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Solution Overview

Problem

Existing multilayer ceramic capacitors face challenges in achieving high coverage of thin inner electrodes, which limits capacitance, despite the addition of common materials to align the sintering temperatures of conductive metal particles with dielectric layers.

Innovation Solution

A conductive paste comprising copper and ABO3 type ceramic powder with a specified ionic radius ratio is used to form inner electrodes, ensuring high coverage even when formed as thin layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the thickness of inner electrodes is reduced to increase capacitance, then the capacitance increases, but the coverage of inner electrodes decreases

Engineering Contradiction:
ImprovecapacitanceVSAvoidcoverage of inner electrodes
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The invention changes the chemical composition parameters of the conductive paste by adding specific ceramic materials (BaTiO3, SrTiO3, CaZrO3) to modify the sintering behavior. This compositional parameter change enables thin-layer electrodes to achieve high coverage by controlling the sintering process to prevent excessive shrinkage that would otherwise reduce coverage.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite conductive paste material combining conductive metal particles with specific ceramic materials (BaTiO3, SrTiO3, CaZrO3). This composite formulation allows the paste to maintain both the conductivity needed for electrode function and the sintering characteristics required to achieve high coverage in thin layers, resolving the contradiction between thickness reduction and coverage maintenance.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If the sintering temperature of conductive metal particles is increased to improve coverage, then the coverage increases, but the temperature difference with dielectric layer sintering increases

Engineering Contradiction:
Improvecoverage of inner electrodesVSAvoidsintering temperature difference
Core Design Contradiction:
Manufacturing precisionVSTemperature

Solution Approach 1:

The invention modifies the sintering temperature parameters by introducing ceramic materials with specific thermal properties. These ceramics act as fluxes that lower the sintering temperature of the conductive paste, allowing it to sinter at temperatures closer to the dielectric layer sintering temperature while still achieving high coverage through controlled shrinkage behavior.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The conductive paste maintains high coverage of inner electrodes, thereby increasing the capacitance of multilayer ceramic capacitors.

Implementation Method 1

the sintering temperature of conductive metal particles included in conductive paste films that are to be the inner electrodes is lower than the sintering temperature of the ceramic that forms the dielectric layers, which means that the metal particles included in the inner electrodes are sintered first

Methodology Applied
Scientific EffectSintering: Sintering

Implementation Method 2

By adding a common material, it is possible to shift the onset of sintering of the metal particles included in the conductive paste films that are to be the inner electrodes toward higher temperatures

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12476047B2Conductive paste
Publication Date: 2025.11.18 MURATA MFG CO LTD
  • US12476047B2 patent drawing

AI summary

A conductive paste included in inner electrodes of a multilayer ceramic capacitor is fired and includes a conductive metal powder, a ceramic powder, an organic solvent, and an organic binder. The conductive metal powder includes copper, and at least a portion of the ceramic powder is a powder of at least one oxide of an ABO3 type with a specified ionic radius in which a ratio of a six-coordinate ionic radius of an A-site element in ABO3 to a six-coordinate ionic radius of copper is about 0.96 or greater and about 1.04 or less.