Copper Plating Solution Stress Relief via Phenylurea Additive
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Solution Overview
Problem
Copper electroplating methods generate deposit stress in films, leading to deformation, reduced adhesive strength, and decreased product reliability and lifetime, especially in one-sided plating applications like touch screens and solar cells, limiting their use due to technical disadvantages and increased production costs.
Innovation Solution
A copper electroplating solution incorporating phenylurea as a deposit stress relieving agent, with concentrations between 0.02 g/l and 0.08 g/l, is used to reduce stress and improve adhesive strength, employing a bath with copper sulfate, sulfuric acid, chloride ions, and glycerin propoxylate ethoxylate derivatives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If copper electroplating is performed using conventional methods, then production cost is reduced, but deposit stress is generated causing film deformation and adhesion deterioration
Solution Approach 1:
The patent modifies the chemical composition parameters of the electroplating solution by introducing specific organic additives (coupling agents and stress relieving agents) at controlled concentrations. This changes the deposition characteristics to reduce stress while maintaining cost-effectiveness
Solution Approach 2:
The patent uses organic coupling agents and stress relieving agents as intermediary substances that mediate between the copper ions and the substrate. These intermediaries facilitate stress-free deposition by modifying the interaction between the plating solution and base material
2Productivity
If one-sided electroplating is applied to reduce manufacturing complexity, then production efficiency is improved, but base material deformation occurs due to unbalanced stress distribution
Solution Approach 1:
The patent adjusts the electroplating solution composition parameters to include stress relieving agents that specifically counteract the asymmetric stress distribution caused by one-sided plating, preventing base material deformation while maintaining production efficiency
3Device complexity
If conventional electroplating solution is used, then manufacturing process is simple, but deposit stress causes broken phenomena due to base material deformation
Solution Approach 1:
The patent introduces stress relieving agents as intermediary substances that absorb and distribute the deposit stress, preventing stress concentration that would otherwise cause base material breaking while keeping the overall process simple
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces deposit stress, prevents deformation, enhances adhesive strength, and increases product reliability and lifetime, making copper electroplating more viable and cost-effective for various applications.
Implementation Method 1
phenylurea as a deposit stress relieving agent
Implementation Method 2
electroplating utilizing the principle of electrolysis
Implementation Method 3
electroplating utilizing the principle of electrolysis
Implementation Method 4
improve the adhesive strength between a base material and an electroplated copper film
Data Source
AI summary
The present invention relates to a copper plating solution for relieving the deposit stress of an electroplated copper film. In the copper electroplating solution of the present invention, glycerin propoxylate ethoxylate is used as a carrier for relieving the deposit stress, and phenylurea is added as a deposit stress relieving additive. The copper electroplating solution of the present invention includes the phenylurea by from about 0.02 to about 0.08 g/l.