Copper Polishing Solution Using Organic Acids and Ultrasonic Vibration
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Solution Overview
Problem
Existing polishing solutions for copper and its alloys using strong inorganic acids and toxic compounds pose environmental and health hazards while being difficult to control and emit toxic gases.
Innovation Solution
A polishing solution comprising citric acid, acetic acid, hydrogen peroxide, ethanol, and water, with ultrasonic treatment, effectively removes contaminants from copper and its alloys without harmful compounds, enhancing polishing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If strong inorganic acids (sulfuric acid, nitric acid) are used for polishing copper and its alloys, then polishing rate is improved, but harmful factors (toxic emissions, corrosiveness, environmental damage) increase
Solution Approach 1:
The patent fundamentally changes the chemical composition parameters of the polishing solution by replacing strong inorganic acids with organic acids (oxalic acid at 10-30% w/w, citric acid at 5-20% w/w) and adding hydrogen peroxide (1-5% w/w) as an oxidizing agent. This parameter substitution maintains effective polishing action while eliminating toxic emissions and reducing corrosiveness to environmentally safe levels.
Solution Approach 2:
The patent converts the harmful effect of strong acids into a beneficial process by using hydrogen peroxide as a controlled oxidizing agent that works synergistically with organic acids. This combination provides effective copper oxide removal and polishing action without the harmful emissions and corrosiveness associated with traditional inorganic acid-based solutions.
2Productivity
If traditional polishing solutions with strong acids are used, then polishing efficiency is improved, but process controllability deteriorates due to strong corrosive effects
Solution Approach 1:
The patent changes the chemical parameters from strong inorganic acids to a milder system of organic acids combined with hydrogen peroxide. This parameter modification maintains high polishing efficiency through the synergistic action of oxalic acid, citric acid, and hydrogen peroxide, while significantly improving process controllability by reducing the aggressive corrosive effects that make traditional solutions difficult to manage.
3Manufacturing precision
If toxic metal salts (cadmium chloride) are added to polishing solutions, then polishing quality is improved, but harmful factors increase due to heavy metal content
Solution Approach 1:
The patent extracts and removes toxic heavy metal salts (specifically cadmium chloride) from the polishing solution composition. Instead, it uses a combination of organic acids and hydrogen peroxide that achieves effective polishing quality without introducing harmful heavy metals, thereby eliminating the associated environmental and health hazards.
Solution Approach 2:
The patent replaces the harmful function of cadmium chloride with a beneficial combination of organic acids and hydrogen peroxide. This substitution maintains the necessary polishing quality and surface finish while converting the harmful heavy metal-based chemistry into an environmentally friendly organic chemistry system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high polishing efficiency with minimal environmental and health impact by using eco-friendly components and ultrasonic treatment, effectively removing impurities in 3 minutes.
Implementation Method 1
hydrogen peroxide in an amount of 0.5-2 % by weight
Implementation Method 2
ultrasonicating the solution using an ultrasonic generator power of 300 W per 10 L of the solution
Implementation Method 3
heating the solution to temperature of 50-70°C
Data Source
Figure 1a~2b
AI summary
The invention relates to a solution for polishing of copper and its alloys, containing citric acid in an amount of 10-15 % by weight, acetic acid in an amount of 0.1-1 % by weight, hydrogen peroxide in an amount of 0.5-2 % by weight, ethanol in an amount of 35-55 % by weight and water. The invention also relates to a method for polishing copper and its alloys.