Copper Post DSM-LGA Packaging for Heat Dissipation and Density
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Solution Overview
Problem
Traditional surface-mount substrates with solder balls face limitations in thermal conductivity and dimensional constraints, leading to inefficiencies in thermal energy dissipation and package size.
Innovation Solution
The use of double-side molded land grid array (LGA) substrates with copper posts of varying shapes and dimensions, formed through batch plating, which offer higher thermal conductivity and a more compact form factor by reducing post height and increasing density, while maintaining desired cross-sectional shapes and providing structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If solder balls are used for electrical connections, then electrical connectivity is achieved, but thermal conductivity is insufficient and package size increases
Solution Approach 1:
The patent changes the material parameter from solder to copper, which has superior thermal conductivity. This material substitution directly addresses the thermal energy dissipation issue while allowing for a more compact package design due to the enhanced thermal performance
Solution Approach 2:
The patent transitions from spherical solder balls to cylindrical copper posts with height-to-width ratios greater than 0.5. This dimensional change from spheres to elongated cylinders optimizes both thermal conduction pathways and space utilization, enabling improved thermal dissipation in a smaller volume
2Reliability
If minimum dimension and distance constraints are applied to solder balls, then manufacturing reliability is maintained, but device density and compactness are reduced
Solution Approach 1:
The patent changes the geometric parameters from spherical to cylindrical shape with controlled height-to-width ratios. This dimensional transformation allows for closer spacing between connection points while maintaining structural integrity and manufacturing reliability, thereby increasing device density
Solution Approach 2:
The patent establishes dynamic parameter ranges for copper post dimensions (height-to-width ratio greater than 0.5) rather than fixed values. This allows optimization of both reliability and density by adjusting dimensions within specified ranges based on specific application requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copper posts provide enhanced thermal energy dissipation and a smaller package size due to their higher thermal conductivity and increased density, addressing thermal management issues and enabling applications in high-energy devices.
Implementation Method 1
the copper posts provide better thermal energy dissipation, thus minimizing issues related to high thermal energy applications
Data Source
AI summary
DSM-LGA using substrates with different surface finish options include copper posts for electrical communication. The copper posts include a height-to-width ratio that cannot be achieved in traditional copper posts, as well as a taper ratio that forms a more rectangular cross section as opposed to traditional copper posts. Additionally, by using copper, the copper posts include a relatively high thermal conductivity (as compared to solder), thus allowing the copper posts to dissipate thermal energy generated by integrated circuits and other processors. Copper posts can take the form of a single, cylindrical post. Alternatively, copper posts can be merged to form a variety of copper structures used for various applications, including I/O, grounding/isolation, and substrate support.