Copper Resin Injection Joining via Chemical Etching
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Solution Overview
Problem
Existing methods for joining metals like copper and copper alloys with resins lack sufficient strength and reliability, especially when using injection joining techniques, due to limitations in surface treatment and resin composition, leading to suboptimal bonding and potential gas leakage in applications like electronic equipment.
Innovation Solution
A method involving chemical etching and surface conversion treatments to create a hard ceramic layer on copper or copper alloys, combined with a specific resin composition, such as polyphenylene sulfide or polybutylene terephthalate, to enhance the injection joining process, ensuring strong bonding and preventing gas leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If injection joining is used to join copper or copper alloys with resins, then productivity is improved, but joint strength is insufficient
Solution Approach 1:
The copper or copper alloy surface undergoes preliminary chemical etching and oxidation treatments before injection joining. The chemical etching creates a roughened surface with increased surface area, while the oxidation forms a copper oxide layer that enhances chemical bonding with the resin, thereby improving joint strength before the actual joining process
Solution Approach 2:
The surface properties of the copper or copper alloy are modified through chemical etching and oxidation, changing the surface roughness and chemical composition. These parameter changes create a surface that is more receptive to resin bonding, resolving the contradiction between maintaining productivity and improving joint strength
2Ease of manufacture
If standard surface treatment is applied to copper or copper alloys, then ease of manufacture is maintained, but bonding reliability is insufficient
Solution Approach 1:
The surface treatment process modifies key surface parameters including roughness, chemical composition, and oxide layer thickness. These changes transform the surface into a state that is highly compatible with resin bonding, improving reliability while maintaining ease of manufacture through established chemical treatment processes
Solution Approach 2:
The treated copper or copper alloy surface forms a composite structure with the resin, where the chemically modified surface layer acts as an intermediate phase that enhances bonding. This composite approach improves bonding reliability while using conventional surface treatment methods
3Strength
If chemical etching and oxidation treatment are applied to copper or copper alloys, then joint strength is improved, but device complexity increases
Solution Approach 1:
The chemical etching and oxidation are performed as preliminary surface preparation steps before injection joining. By completing these treatments in advance, the actual joining process remains simple and efficient, while the joint strength is improved through the modified surface properties
Solution Approach 2:
The chemical etching and oxidation processes are self-contained treatments that prepare the surface without requiring complex equipment or multi-step procedures during the joining process itself. The surface treatment is self-sufficient and integrates well with standard manufacturing workflows
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high joint strength and reliability between copper or copper alloys and resins, effectively preventing gas leakage and enhancing the durability of electronic components.
Implementation Method 1
a surface of the shaped substrate is dissolved by chemical etching and a surface thereof is covered with a thin layer of a copper oxide formed by an oxidant under strongly basic conditions
Implementation Method 2
a surface of the shaped substrate is dissolved by chemical etching
Implementation Method 3
a first resin composition or a second resin composition is injected into the metallic mold with the shaped substrate inserted and is joined to the surface
Data Source
AI summary
An object of the present invention is to obtain a composite in which a copper or copper alloy is securely integrated with and joined to PBT or PPS. A copper product that has been suitably roughened by chemical etching and also blackened can be used favorably. A surface-treated copper piece 1 is inserted into a cavity formed by a movable molding plate 2 and a stationary molding plate 3 of an injection molding mold 10, and a specific resin is injected to obtain an integrated product. PBT or PPS can be used as the resin component of a resin composition 4 that is used here. High injection joining strength is obtained if the resin composition contains, as an auxiliary component, PET and/or a polyolefin resin in the case of PBT, and a polyolefin resin in the case of PPS.