Copper-Titanium Alloy Strength and Bending Workability

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional copper titanium alloys face a challenge in achieving a balance between strength and bending workability, particularly in the context of miniaturized electronic components where both properties need to be enhanced to meet the demands of increasingly smaller connectors.

Innovation Solution

The copper titanium alloy is formulated with specific Ti concentration fluctuations, controlled by adjusting the coefficient of variation and ten-point average height in the Ti concentration fluctuation curve, along with the inclusion of certain third elements, to optimize strength and bending workability. This involves precise heat treatment and cold rolling processes to manage the distribution and size of second-phase particles, ensuring a balance between strength and flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the draft of cold rolling is increased to increase dislocation density and improve strength after aging treatment, then the strength is improved, but the bending workability worsens

Engineering Contradiction:
Improvestrength after aging treatmentVSAvoidbending workability
Core Design Contradiction:
StrengthVSEase of manufacture

Solution Approach 1:

The patent applies parameter changes by precisely controlling the draft of cold rolling within 5-50% and the heating temperature within 700-950°C during heat treatment. These parameter optimizations enable the material to achieve both high strength (improved by dislocation density control) and good bending workability (maintained by preventing excessive work hardening), thereby resolving the technical contradiction between strength improvement and bending workability preservation

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs local quality by creating a modulation structure with periodic fluctuations of Ti concentration in the matrix phase through spinodal decomposition. This results in non-uniform distribution of Ti concentration and dislocation density at the microstructural level, where locally strengthened regions provide high strength while the overall structure maintains flexibility and bending workability

Inventive Principle:
Principle #3Local quality

2Strength

If the concentration of third elements is increased to improve strength and bending workability balance, then the property balance is improved, but the alloy composition complexity increases

Engineering Contradiction:
Improvebalance between strength and bending workabilityVSAvoidalloy composition complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent optimizes the concentration parameters of third elements (Fe, Co, Ni, Si, Cr, Zr, Mo, V, Nb, Mn, B, or P) within specific ranges (0.003-0.05 mass% for most elements, 0.001-0.03 mass% for B). This parameter optimization allows the alloy to achieve improved balance between strength and bending workability while controlling composition complexity through defined concentration limits

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The optimized copper titanium alloy achieves improved strength and bending workability, resulting in a material suitable for high-reliability electronic components with enhanced performance in miniaturized applications.

Implementation Method 1

When a supersaturated solid solution of Ti that is a solute atom is formed by solution treatment, and heat treatment is performed from the state at low temperature for a relatively long time, a modulation structure that is periodical fluctuations of Ti concentration develops in the matrix phase by spinodal decomposition, and the strength improves.

Methodology Applied
Scientific EffectSpinodal decomposition:

Implementation Method 2

a modulation structure that is periodical fluctuations of Ti concentration develops in the matrix phase by spinodal decomposition, and the strength improves

Methodology Applied
Scientific EffectPrecipitation hardening: Precipitation Hardening

Data Source

PatentUS10351932B2Copper-titanium alloy for electronic component
Publication Date: 2019.07.16 JX NIPPON MINING & METALS CORP
  • US10351932B2 patent drawing

AI summary

The present invention controls the fluctuations of Ti concentration in a copper titanium alloy from a perspective different from conventional perspectives to improve the strength and bending workability of the copper titanium alloy. A copper titanium alloy for electronic components comprising 2.0 to 4.0 mass % of Ti, and 0 to 0.5 mass %, in total, of one or more elements selected from the group consisting of Fe, Co, Mg, Si, Ni, Cr, Zr, Mo, V, Nb, Mn, B, and P as a third element, with the balance being copper and unavoidable impurities, wherein a coefficient of variation in a Ti concentration fluctuation curve is 0.2 to 0.8, the Ti concentration fluctuation curve being obtained when Ti in a matrix phase for <100>-oriented crystal grains in a cross section parallel to a rolling direction is subjected to line analysis by EDX, and in structure observation of a cross section parallel to the rolling direction, a number of second-phase particles having a size of 3 μm or more per an observation field of view of 10000 μm2 is 35 or less.