Conductive Material TRIZ Cases

A Cu-Ni-Si alloy sheet uses controlled Ni-Si precipitate distribution to enhance shear workability.

Synthesizing nickel manganese cobalt composite carbonate via controlled precipitation to achieve high tap density and specific surface area.

A copper alloy wire uses precise Co, P, and Sn composition to drive precipitation hardening within the matrix.

A conductive coating process applies halide ions in water to enhance electrical conductivity at low temperatures.

A metal ink combines C4-12 amine and C22-26 fatty acid protective agents to stabilize silver particle dispersion.

Cross-linked polyacrylic acid binders maintain electrode structure integrity and capacity retention despite large volume changes in silicon active materials.

Ultrasonic mixing in supercritical carbon dioxide creates a surface conductive layer, reducing filler dosage while maintaining resin strength.

A lead-free paste composition containing lithium and glass frits forms electrical contacts on solar cell devices.

Replacing sulfonic acid with fluorinated alkyl groups reduces residual moisture and H+ generation, improving organic EL device durability.

Adding rare earth elements to 8000-series aluminum alloy wire boosts creep resistance and stress relaxation without reducing electrical conductivity.

Rhodium and Pb-Te-O in conductive paste form solar electrodes that improve solder adhesion without sacrificing electrical performance.

Optimized Cu-Co-Si alloy composition with controlled second-phase particle distribution enhances mechanical strength and electrical conductivity.

Composite oxide sintered body enables electrostatic wafer clamping at low voltage, preventing damage in halogen-based corrosive environments.

High resistance carbon-loaded wiring prevents electrical arcing and sparking during lightning strikes, ensuring safety in fuel tanks.

Deuterated conductive polymer doped with fluorinated acid resolves low conductivity in OLED buffer layers.

All-aluminum back surface field paste replaces silver to eliminate metal defects, preventing electric leakage while enhancing ohmic contact.

Nonuniform mass distribution in nonwoven fibers prevents size variations and wrinkles caused by water impregnation while maintaining proton conductivity.

A conductive sheet manufacturing method uses hydrophilic electron conducting polymer microparticles combined with fibrous material to form a stable layer.

A mixed lithium metal oxide cathode active material combines spray-dried and co-precipitated components to enhance power retention.

A silicone-based interface material with metal flakes bonds circuit boards to heat sinks.

Continuous melt emulsification eliminates solvent distillation energy while preventing coarse material formation through preliminary thorough mixing.

Reacting carbon nanotubes with aluminum creates dispersed aluminum carbide, improving tensile strength while maintaining electrical conductivity.

A pyrrole-phenoxazine polymer compound enables solution-processable hole injection layers with high hole-transporting capability.

Polymerizable binders in nanometal ink prevent aggregation, enabling physical contact between nanoparticles for improved conductivity and adhesion.

Glass intermediary layers bridge sintering temperature mismatches to prevent residual stress separation in laminated surge absorbing materials.

A stretchable polymer thin film integrates a composite semiconductor with an elastomer to maintain high charge mobility.

A copper magnesium zinc alloy achieves high proof stress and conductivity through supersaturated solid solution treatment.

Phosphine additives resist hydrolysis in strong acids, maintaining proton conductivity and mechanical strength under low humidity.

High molecular weight acrylonitrile-acrylic acid copolymer binder enhances adhesion to current collectors in lithium secondary battery anodes.

An electric solenoid uses an aluminum-graphene composite wire core to stabilize magnetic actuating force against temperature-dependent resistance increases.

A dual-paste system with distinct lead-bismuth and zinc-vanadium binders improves adhesion and passivation on crystalline silicon solar cells.

Flocculating carbon nanotubes in a metallic ion solvent solves uneven dispersion and low metal ratios found in spray methods.

A copper alloy sheet dissipates heat from flexible printed circuit boards while maintaining tensile strength.

Crosslinked polymer templates guide polyaniline growth for durable conductive patterns.

Porous wire cross-sections reduce conductor mass and electromagnetic noise without increasing weight, resolving the diameter-mass trade-off.

Fluorinated alkyl groups raise the glass transition point above 80°C and suppress water solubility to extend organic EL emission lifetime.

Composite particle with silicon-rich rim and carbon core manages lithium alloying expansion in negative electrode materials.

LiVOPO4 coatings suppress oxygen release and Mn3+ elution in lithium ion batteries, maintaining discharge energy at elevated temperatures.

Metal nanowires coated with monosaccharides reduce haze while maintaining conductivity in touch panels.

Chlorinated polyethylene reduces adhesion between cable layers, enabling easy stripping without carbon residue or agglomeration issues.

Green synthesis of conductive silver/polyaniline nanocomposites eliminates toxic solvents and extreme conditions while maintaining high conductivity.

Adding perfluorinated polymeric acid resolves low conductivity and work function in aqueous dispersions, enabling high-performance anodes without ITO.

A fluorinated copolymer binder composition enhances electrode adhesion while resisting electrolyte swelling at high temperatures.

A photo polymerizable monomer composition cures into a flexible heat conductive sheet with high thermal conductivity and sufficient cohesive strength.

A copper titanium alloy uses spinodal decomposition to improve strength.

Replacing copper atoms in nanowire templates with silver ions preserves wire length while boosting conductivity and reducing oxidation susceptibility.

A Cu-Ni-Si copper alloy adjusts {111} and {200} plane integration via cold rolling to achieve high strength.

A thick film resistor composition incorporates a copper-containing glass frit to stabilize electrical properties.

Replacing cobalt oxide with zinc oxide in NTC ceramics reduces production costs while maintaining activation energy and resistivity.

Phase change ink composition with metal nanoparticles and sulfur-containing solvents resolves nanoparticle settling and head compatibility issues.