Cu-Ni-Si Alloy Sheet Mold Abrasion Resistance
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Solution Overview
Problem
Cu—Ni—Si-based copper alloy sheets lack sufficient mold abrasion resistance and shear workability while maintaining tensile strength and conductivity, which is essential for applications like vehicle electric connectors and print substrate terminals.
Innovation Solution
A Cu—Ni—Si-based copper alloy sheet with 1.0 to 4.0 mass % Ni, 0.2 to 0.9 mass % Si, and specific Ni—Si precipitate particle distributions, along with additional elements like Sn, Zn, Mg, Fe, P, C, Cr, and Zr, is developed, forming intermetallic compounds and solid solutions to enhance strength, conductivity, and workability through controlled thermal treatments and rolling processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If Cu—Ni—Si-based copper alloy is used to achieve high strength and high conductivity, then tensile strength and conductivity are improved, but mold abrasion resistance and shear workability deteriorate
Solution Approach 1:
The patent applies parameter changes by precisely controlling the composition parameters (Ni: 1.0-4.0 mass%, Si: 0.2-0.9 mass%) and processing parameters (solution treatment temperature: 800-950°C, aging treatment temperature: 200-400°C) to achieve the optimal balance between strength and mold abrasion resistance. This resolves the contradiction by finding the specific parameter range where both high tensile strength and excellent mold abrasion resistance coexist
Solution Approach 2:
The patent creates a composite microstructure consisting of Cu matrix with dispersed Ni-Si intermetallic compounds (Ni3Si, NiSi, NiSi2). This composite structure at the micro level provides both the strength from the intermetallic compounds and the mold abrasion resistance from the Cu matrix, resolving the contradiction between strength and mold durability
2Strength
If Cu—Ni—Si-based copper alloy is used to achieve high strength, then tensile strength is improved, but shear workability deteriorates
Solution Approach 1:
The patent controls the aging treatment temperature (200-400°C) and time to achieve optimal precipitate distribution and size. This parameter optimization ensures that the alloy maintains high tensile strength while achieving excellent shear workability with burr length of 0.05mm or less, resolving the contradiction between strength and shear operation ease
Solution Approach 2:
The patent applies partial action by controlling the aging treatment to achieve just the right amount of precipitation hardening. The aging treatment is applied partially (not excessive) to maintain ductility and shear workability while still achieving high tensile strength of 600MPa or more
3Strength
If active elements are added to Cu—Ni—Si-based copper alloy to enhance strength, then tensile strength is improved, but mold abrasion resistance deteriorates
Solution Approach 1:
The patent changes the concentration parameters of active elements (Ni: 1.0-4.0 mass%, Si: 0.2-0.9 mass%) to achieve optimal strength while minimizing mold abrasion. By precisely controlling these composition parameters and combining them with optimized heat treatment parameters, the patent resolves the contradiction between strength enhancement and mold abrasion resistance
Solution Approach 2:
The patent converts the potentially harmful effect of active elements causing mold abrasion into a benefit by controlling their content and distribution. The Ni and Si elements, which could cause abrasion, are controlled to form fine intermetallic compounds that strengthen the alloy while the controlled distribution minimizes mold abrasion, turning a harmful factor into a beneficial strengthening mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The alloy achieves excellent mold abrasion resistance and shear workability while maintaining tensile strength and conductivity, suitable for demanding applications like vehicle connectors and print substrate terminals.
Implementation Method 1
Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm
Implementation Method 2
the concentration of Si forming a solid solution in crystal grains
Implementation Method 3
an aging treatment is carried out so that the average crystal grain diameter in the copper alloy sheet reaches 10 μm or less
Data Source
AI summary
A Cu—Ni—Si-based copper alloy sheet of the invention has excellent mold abrasion resistance and shear workability while maintaining strength and conductivity, in which 1.0 mass % to 4.0 mass % of Ni is contained, 0.2 mass % to 0.9 mass % of Si is contained, the remainder is made up of Cu and inevitable impurities. The number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a surface layer that is as thick as 20% of the entire sheet thickness from the surface is represented by a particles/mm2, and the number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a portion below the surface layer is represented by b particles/mm2, a/b is in a range of 0.5 to 1.5.