Copper Wire Oxide Removal Composition
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Solution Overview
Problem
The challenge is to selectively remove and prevent the formation of oxides on the surface of metal wires, particularly copper, which are prone to oxidation during semiconductor and display device manufacturing processes, leading to increased electrical resistance and corrosion, hindering the production of fine low-voltage circuit structures.
Innovation Solution
A composition comprising a compound represented by Chemical Formula 1, an organic solvent, and water, where the compound coordinates with the metal to remove oxygen atoms from the oxide layer, preventing further oxidation and corrosion, while the organic solvent aids in solubility and solvation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper is used as metal wire material due to excellent electrical conductivity and low cost, then electrical conductivity and cost-effectiveness are improved, but the wire surface becomes covered with oxide during manufacturing processes, increasing electrical resistance
Solution Approach 1:
The patent applies preliminary action by forming a protective organic compound layer on the copper wire surface before oxidation occurs. The mercapto compound coordinates with copper atoms to create a barrier that prevents oxygen from reaching and oxidizing the metal surface during subsequent manufacturing processes such as heat treatment and exposure.
Solution Approach 2:
The patent uses an intermediary approach by introducing organic compounds containing mercapto groups as mediator substances. These compounds act as intermediaries between the copper surface and the oxidizing environment, forming a coordination compound layer that blocks direct contact between oxygen and copper, thereby preventing oxide formation while maintaining electrical conductivity.
2Object-generated harmful factors
If aqueous cleaning compositions are used to remove copper oxides, then oxide removal capability is improved, but selective removal of oxide without affecting metal film is not achieved
Solution Approach 1:
The patent applies local quality by designing a cleaning composition with specific local characteristics - containing chelating agents that have selective affinity for copper oxide rather than metallic copper. The composition is formulated to locally target and remove oxide layers while leaving the underlying metal film intact, achieving selective removal through differential chemical interaction.
Solution Approach 2:
The patent uses parameter changes by adjusting the chemical composition parameters of the cleaning solution, specifically incorporating chelating agents with controlled concentration and molecular structure. These parameter adjustments enable the solution to differentiate between oxide and metal states, allowing selective removal of oxide while preserving the metallic copper surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively removes surface oxides, maintaining the electrical conductivity of metal wires and preventing corrosion, enabling the production of finer metal circuit wiring.
Implementation Method 1
the compound coordinates with the metal to remove oxygen atoms from the oxide layer
Implementation Method 2
preventing further oxidation and corrosion
Implementation Method 3
the organic solvent aids in solubility and solvation
Data Source
Figure 1~2
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AI summary
The present invention proposes a method for removing an oxide formed on the surface of a copper film used in the process of manufacturing a circuit for a semiconductor, an organic light-emitting diode, an LED, or a liquid crystal display without causing corrosion on a lower metal film. The composition including corrosive amine may remove a metal oxide depending on the content of additive ranging from 0.01 to 10% regardless of the content of ultrapure water. A polar solvent other than the corrosive amine may efficiently remove an oxide from the surface of the metal when the same contains water and 0.01 to 20% of the additive.