Coreless PCB with Embedded Components for Power Integrity
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Solution Overview
Problem
The increasing demand for high-performance electronic products with larger and more complex substrates, such as Flip Chip Ball Grid Array (FCBGA) substrates, leads to higher costs and reduced yield due to technical difficulties, and there is a need for technologies that can reduce costs while maintaining performance and improving power integrity.
Innovation Solution
A printed circuit board with a coreless structure that embeds electronic components on its outer side, utilizing multiple insulating and wiring layers connected by via layers, allowing for easier embedding of electronic components and improved power integrity by reducing the distance between components and semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the size and number of layers of FCBGA substrate are increased to meet high-performance requirements, then the performance of electronic products is improved, but the manufacturing cost increases and yield decreases due to technical difficulties
Solution Approach 1:
The substrate is divided into multiple layers (first insulating layer, second insulating layer, wiring layers) with electronic components embedded at specific interfaces. This segmentation allows complex high-performance functionality to be achieved through modular layering rather than a single monolithic structure, reducing manufacturing difficulty while maintaining performance
Solution Approach 2:
Electronic components are embedded within the substrate structure itself, nested between insulating layers and integrated with wiring layers. This nesting approach reduces the overall footprint and allows high integration without proportionally increasing manufacturing complexity, as components are incorporated during the layering process rather than added separately
2Reliability
If electronic components are embedded in the substrate, then power integrity is improved by reducing distance between components and chips, but the manufacturing process becomes more complex
Solution Approach 1:
Electronic components are embedded at the interface between insulating layers during the substrate fabrication process itself, before final assembly. This preliminary action of embedding components early in the manufacturing sequence simplifies the overall process compared to post-fabrication embedding, as the component placement is integrated into the layering and curing steps
Solution Approach 2:
The substrate structure is designed with specific local features at the component embedding interface, including localized wiring layers and via structures positioned precisely where components are embedded. This local optimization allows power integrity to be improved at specific critical locations without requiring complex modifications throughout the entire substrate structure
Data Source
AI summary
A printed circuit board includes a first insulating layer, a second insulating layer disposed on a lower surface of the first insulating layer, an electronic component embedded in the second insulating layer and at least partially in contact with the first insulating layer, a first wiring layer disposed on an upper surface of the first insulating layer, a second wiring layer disposed on a lower surface of the second insulating layer, and a first wiring via penetrating through the first and second insulating layers and connecting at least portions of the first and second wiring layers to each other.