Coreless Substrate Conductive Pillars for Fine Pitch Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional fiberglass substrate packaging structures are costly, prone to deformation, and have complex and time-consuming laser via formation processes, making them unsuitable for fine pitch applications and increasing manufacturing costs.
Innovation Solution
A coreless substrate with a dielectric material or molding compound layer and plating conductive pillars is used, along with a conductive adhesive layer formed by dispense or print processes, to achieve a thin-type structure with improved rigidity and reduced production complexity, replacing traditional fiberglass substrates and complex laser via methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fiberglass substrate is used in conventional packaging structures, then electrical connection and component mounting are achieved, but the substrate is costly, prone to deformation, and increases manufacturing complexity
Solution Approach 1:
The patent removes the fiberglass substrate entirely from the packaging structure, extracting the problematic element that caused deformation and manufacturing complexity. The coreless substrate design eliminates the need for traditional substrate materials while maintaining electrical connection functionality through conductive pillars and adhesive layers.
Solution Approach 2:
The patent employs composite material structures by combining molding compound layers with conductive adhesive layers and plating conductive pillars. This composite approach creates a stable, deformation-resistant structure that replaces the problematic fiberglass substrate while achieving the desired electrical and mechanical properties.
2Manufacturing precision
If laser via method is used to form via holes in fiberglass substrate, then electrical connection paths are created, but the process is time-consuming and costly for fine pitch applications
Solution Approach 1:
The patent replaces the laser via formation process with a plating-based conductive pillar formation process. Instead of using laser energy to create via holes in fiberglass, the invention uses electroplating or electroless plating to directly form conductive pillars within the molding compound, eliminating the time-consuming laser processing step while achieving fine pitch precision.
3Reliability
If four-layered metal laminated structure with blind/buried vias is formed by repetition of laser via method, then electrical connection is achieved, but the process becomes complex and costly
Solution Approach 1:
The patent merges multiple manufacturing steps into a unified plating process. Instead of repeatedly forming laser vias and then plating, the invention combines the via formation and plating into a single step by directly forming conductive pillars through plating on conductive adhesive patterns within the molding compound, significantly simplifying the manufacturing process while maintaining electrical connection reliability.
4Length of stationary object
If thin-type fiberglass substrate is used, then device thickness is reduced, but the substrate becomes easily deformed and wrapped
Solution Approach 1:
The patent uses composite material structures combining molding compound layers with conductive adhesive layers and embedded plating conductive pillars. This composite design provides the necessary rigidity and strength to prevent deformation and wrapping, even in thin-type structures, while eliminating the need for fiberglass substrate that is prone to deformation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, simplifies the process, enhances electrical properties, and allows for more flexible circuit designs with improved signal stability and component reliability, enabling denser component packing in smaller spaces.
Implementation Method 1
a plating conductive pillar layer is provided in the coreless substrate so as to be used for achieving electrical connection
Implementation Method 2
a conductive adhesive layer is formed by the use of a dispense process or a print process so as to be used for fixing and embedding a plurality of internal components inside the coreless substrate
Data Source
AI summary
A package apparatus comprises a first conductive wiring layer, a first conductive pillar layer, a first conductive glue layer, an internal component, a second conductive pillar layer, a first molding compound layer and a second conductive wiring layer. The first conductive pillar layer is disposed on the first conductive wiring layer. The first conductive glue layer is disposed on the first conductive wiring layer. The internal component has a first electrode layer and a second electrode layer, wherein the first electrode layer is disposed and electrical connected to the first conductive glue layer. The second conductive pillar layer is disposed on the second electrode layer. Wherein the first conductive wiring layer, the first conductive pillar layer, the first conductive glue layer, the internal component and the second conductive pillar layer are disposed inside the first molding compound layer.