Electronic Component Corner Reinforcement for Dicing Crack Prevention
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Solution Overview
Problem
Existing electronic component manufacturing processes often result in microcracks near bumps and peeling of the cover member during cutting, leading to stress and potential resin infiltration, which can cause cracks in the substrate and affect the integrity of the surface acoustic wave device.
Innovation Solution
The introduction of a resin reinforcing portion with the same height as the support layer in the outer side portion of the corner of the support layer, which reduces or prevents crack formation and peeling by distributing cutting stress and maintaining structural integrity during the dicing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the support layer is located inside dicing lines and a resin connecting portion is formed to connect adjacent support layer parts, then the support layer can be connected during cutting, but microcracks form near the bumps and cracks can extend into the piezoelectric substrate
Solution Approach 1:
A resin reinforcing portion is introduced as an intermediary element between the support layer and the substrate. This reinforcing portion acts as a mediator that absorbs and distributes cutting stresses, preventing stress concentration at the support layer corners and avoiding crack formation or propagation into the piezoelectric substrate.
Solution Approach 2:
The resin reinforcing portion is formed beforehand during the manufacturing process, before the dicing operation. It provides pre-cushioning protection by being positioned to absorb the impact and stress of the dicing blade, thereby preventing microcrack formation near the bumps and preventing crack propagation into the substrate.
2Stability of the object's composition
If the cover member closes the openings of the support layer, then the support layer is sealed, but the cover member peels from the support layer during cutting operation and resin may infiltrate inside the support layer
Solution Approach 1:
The resin reinforcing portion is formed in advance before the dicing operation to provide protective cushioning. It absorbs the mechanical stress and peeling forces during cutting, preventing the cover member from detaching from the support layer and preventing resin infiltration into the support layer structure.
Solution Approach 2:
The resin reinforcing portion serves as an intermediary bonding element between the cover member and the support layer. It enhances the adhesion and mechanical coupling, acting as a buffer zone that prevents direct stress transmission from the dicing blade to the cover member-support layer interface.
Data Source
AI summary
An electronic component includes a functional electrode provided on a first substrate that has a rectangular or substantially rectangular plate shape and a support layer including resin that surrounds the functional electrode. A cover member closes an opening of the support layer. A via conductor penetrating the support layer is provided in at least one corner portion of the support layer. A resin reinforcing portion having the same height or substantially the same height as the support layer is provided in an outer side portion of the corner portion provided with the via conductor.