Counter-flow Heat Exchange Substrate Support for PECVD
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Solution Overview
Problem
Controlling the temperature of a substrate support during plasma enhanced chemical vapor deposition (PECVD) processes is challenging due to heat generated by the plasma, which affects the substrate and support, requiring improved temperature management.
Innovation Solution
A substrate support assembly with a counter-flow heat exchanger design, featuring alternating first and second fluid passages across the support plate, and fluid supply and return manifolds, allows for precise temperature control by circulating a heat transfer fluid in alternating directions, effectively managing thermal energy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single-direction fluid passage system is used for cooling the substrate support, then the structure is simpler, but the temperature control precision and response speed are insufficient
Solution Approach 1:
The fluid passage system is segmented into multiple independent passages (first fluid passages and second fluid passages) that flow in opposite directions. This segmentation allows each passage to independently contribute to heat removal, improving temperature control precision while distributing the thermal management function across multiple channels rather than relying on a single complex system.
Solution Approach 2:
The patent implements counter-flow by having the first fluid passages and second fluid passages flow in opposite directions through the substrate support. This inversion of flow direction enables more efficient heat exchange, as the cooler fluid in one passage encounters the warmer regions created by the opposing flow, enhancing temperature control precision without requiring overly complex external control systems.
2Productivity
If plasma energy is increased to improve deposition rate, then productivity increases, but heat generation increases causing temperature control difficulties
Solution Approach 1:
The patent converts the harmful heat generated by high-energy plasma into a manageable thermal management challenge by implementing an enhanced heat exchange system. The counter-flow fluid passages efficiently remove the excess heat as a controlled function, allowing the plasma to operate at high energy levels for improved deposition rate while the heat removal system handles the thermal byproduct, thus converting the harmful effect into a controlled process parameter.
Solution Approach 2:
The patent changes the thermal management parameters by implementing counter-flow heat exchange with multiple fluid passages, altering how heat is removed from the substrate support. This parameter change in the heat removal mechanism enables the system to handle higher plasma energy inputs, thereby supporting higher productivity while maintaining temperature control through modified thermal exchange characteristics.
3Stability of the object's composition
If fluid passages are extended across the entire substrate support surface, then temperature uniformity improves, but manufacturing complexity and cost increase
Solution Approach 1:
The fluid passage system is segmented into multiple discrete first and second passages distributed across the substrate support surface. This segmentation achieves temperature uniformity by distributing heat removal at multiple locations, while each individual passage remains relatively simple in structure, facilitating manufacturing through standardized passage patterns rather than requiring a single complex continuous passage system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables rapid and precise temperature control of the substrate support, enhancing processing stability and efficiency by maintaining a consistent substrate temperature during PECVD processes.
Implementation Method 1
The first fluid passages and the second fluid passages extend across an upper surface of the substrate support in an approximately alternating manner
Implementation Method 2
The heat transfer fluid is flowed in a first direction through a plurality of first fluid passages from a first end of the support plate assembly to a second end of the support plate assembly. The heat transfer fluid is flowed in a second direction through a plurality of second fluid passages from the second end of the support plate assembly to the first end of the support plate assembly
Implementation Method 3
A substrate support assembly with a counter-flow heat exchanger design, featuring alternating first and second fluid passages across the support plate
Data Source
AI summary
Embodiments described herein generally relate to a temperature control system in a substrate support assembly. In one embodiment, a substrate support assembly is disclosed. The substrate support assembly includes a support plate assembly The support plate assembly includes a first fluid supply manifold, a second fluid supply manifold, a first fluid return manifold, a second fluid return manifold, a plurality of first fluid passages, a plurality of second fluid passages, and a fluid supply conduit. The plurality of first fluid passages extend from the first fluid supply manifold to the first fluid return manifold. The plurality of second fluid passages extend from the second fluid supply manifold to the second fluid return manifold. The plurality of fluid passages extend across an upper surface of the support plate assembly in an alternating manner. The fluid supply conduit is configured to supply a fluid to the fluid supply manifolds.