Electric Discharge Tubes TRIZ Cases

A shroud directs gaseous radical species toward a substrate while preventing precursor gas entry.

Alternating chlorine, fluorine, and oxygen plasma steps form vertical openings in tungsten films by converting non-volatile chlorides to volatile fluorides.

Segmented dielectric protrusions in the waveguide control plasma density distribution, resolving localized generation issues during high-pressure processing.

A rotary sputtering target assembly uses a plated bonding surface to bond the target material to the backing tube.

Front gas injection shield directs inert gas flow over the target surface to optimize plasma confinement and sputtering efficiency.

Rectifier and capacitor circuit adjusts lower electrode potential to reduce ion energy incident on substrate.

Optical control of heating elements reduces through-hole area and assembly complexity in electrostatic chucks.

Segmented gas channels and an intermediary mixing volume lower RF power requirements while reducing substrate contamination from ion bombardment.

Inductively coupled plasma sweeping source generates high-density plasma fields without moving parts to deposit metal layers on large substrates.

A segmented inner plate controls electric field intensity to resolve etch uniformity variations in plasma processing.

A method records cathode parameter changes over usage time to estimate electron gun lifetime using approximation lines.

Movable magnets and temperature detectors prevent target melting during high-power sputtering, ensuring consistent film quality.

Oxygen ashing treatment hydrophilizes organic resin surfaces for reliable copper via-hole electroplating.

Pillar-supported membranes in this vacuum fluid sampler eliminate spacer-induced bulging for stable liquid layer thickness under pressure.

A ceramic stage embeds a radio-frequency electrode extending below the placement surface to concentrate electric fields for plasma generation.

An electrostatic lens inside a magnetic object lens corrects focus while managing secondary electron density.

Replacing optical lenses with an electrostatic lens and partial electrodes corrects image distortions and reduces aberration effects in multi-beam sources.

Gas cluster ion beams treat non-planar structures via controlled incidence angles, preventing sub-surface damage during sidewall modification.

Decoupling the plasma generation zone from the rotary carrier minimizes heat input and wear on mechanical components, extending service life.

A scatter mechanism with a collision block redirects plasma impurities away from the generation unit.

Segmented conductive rings suppress etching rate fluctuations caused by wear, maintaining process stability.

A plasma chamber system uses dynamic voltage changes to initiate ionization.

Adjusting ion beam position and substrate scan speed compensates for processing non-uniformities across large wafers.

Upright contact planes against a central plate improve heat dissipation and prevent false connections during frequent plugging.

Rotating the wafer in an alignment chamber before transfer corrects position errors caused by non-uniform heating zones, resolving etching uniformity issues.

Alternating fluid passages circulate heat transfer fluid in opposite directions to manage plasma-generated thermal energy during deposition.

A segmented baffle structure with movable second members controls radial conductance to resolve uneven gas flow from non-central exhaust connections.

Segmenting vacuum zones with a transfer mechanism enables batch solder sealing of detector modules, increasing production throughput.

A plasma etching chamber uses ion removal to concentrate radicals at the substrate center.

A control unit interrupts the ion beam while a plasma shower device ignites, suppressing load current and protecting power supply stability.

An optical surface modification technique uses eigenvalue optimization to resolve manufacturing precision trade-offs in complex boundary conditions.

Asymmetric electrode roughness in electrostatic chucks mitigates heat-induced non-uniformity, enhancing plasma density stability.

A charged particle beam writing method uses adaptive time interval patterns to diagnose and correct beam drift during irradiation.

Thermally coupled measuring resistors stabilize current measurement accuracy against temperature fluctuations, ensuring reliable beam focusing.

Contact sensors on the transporting rod detect container engagement, enabling precise placement without visual inspection in sealed environments.

Parallel extension portions generate electromagnetic coupling to reduce crosstalk interference without adding shielding volume.

An elliptical airtight container houses assist gas to generate plasma while minimizing heat transfer to the vessel walls.

Heated electrodes stabilize atmospheric pressure argon plasma, enabling low-temperature cleaning and etching of thermally sensitive substrates.

A dielectric injector accelerates electrons from an electron source chamber into a plasma processing chamber, resolving low pressure uniformity challenges.

Variable backside gas pressure and preliminary load-lock heating resolve the contradiction between precise wafer temperature control and high throughput.

Nested spiral coils in a quadrupole antenna generate a uniform near-field Poynting vector, eliminating capacitive voltage issues from close coil placement.

Cylindrical pins with controlled gaps align masks while preventing galling between contact surfaces.

A nucleonic instrument uses a heat pipe to cool the detector probe in high ambient temperatures.

A dual position magnetron assembly adjusts its closed loop magnetic field to maximize target utilization and maintain low cathode voltage.

A recessed aperture specimen carrier enables precise re-thinning and orientation of samples for ex-situ lift-out milling.

Segmenting the detection window into a base and cannular tube resolves uneven surface issues that degrade optical transmittance during semiconductor processing.

Air core primary inductors minimize RF power loss and improve processing repeatability by reducing energy dissipation in filter circuits.

An energy saving outlet uses a sensor and control unit to detect equipment starting signals and manage relay switching for power delivery.

Optical microscopy locates target objects within biological samples before focused ion beam processing exposes specific cross sections.

Segmented partition frames and wire supports replace thick solid bodies to eliminate thermal resistance and improve heating uniformity.