Via-Hole Electroplating Defect Prevention Using Oxygen Ashing
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Solution Overview
Problem
The formation of via-holes in organic resin layers using fluorine-based plasma etching often results in hydrophobic surfaces, making it difficult for electroplating solutions to enter, leading to wiring defects in electronic components.
Innovation Solution
A manufacturing method involving the formation of a first and second metal layer, followed by plasma etching with a fluorine-containing gas, oxygen ashing treatment to hydrophilize the organic resin layer surface, and subsequent electroplating to form a third metal layer, ensuring the electroplating solution can enter the via-holes and maintain hydrophilicity for stable component production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If plasma etching using fluorine-based reactant gas is performed to form via-holes, then etching precision is improved, but the organic resin layer surface becomes hydrophobic making electroplating solution entry difficult
Solution Approach 1:
Oxygen plasma treatment is performed as a preliminary step before electroplating to modify the surface properties of the organic resin layer. This treatment creates oxygen-containing functional groups on the surface, enhancing wettability and ensuring reliable electroplating solution entry into the via-holes formed by fluorine-based plasma etching.
Solution Approach 2:
The surface properties of the organic resin layer are changed by applying oxygen plasma treatment, which modifies the chemical composition and surface energy parameters. This parameter change transforms the hydrophobic surface created by fluorine-based etching into a hydrophilic surface that allows electroplating solution to enter the via-holes effectively.
2Manufacturing precision
If fluorine-based plasma etching is used to form via-holes, then via-hole shape precision is improved, but wiring defect risk increases due to hydrophobic surface
Solution Approach 1:
Oxygen plasma treatment is applied as a preliminary step before electroplating to prevent wiring defects. By modifying the surface wettability of the organic resin layer, this treatment ensures that the electroplating solution can reliably enter the via-holes, preventing copper filling defects and subsequent wiring failures.
Solution Approach 2:
Oxygen plasma treatment acts as an intermediary process between fluorine-based plasma etching and electroplating. It mediates the transition from a hydrophobic surface (unsuitable for electroplating) to a hydrophilic surface (suitable for electroplating), ensuring reliable copper via-hole formation without wiring defects.
3Reliability
If oxygen ashing treatment is performed after fluorine-based plasma etching, then surface hydrophilicity is improved, but process complexity increases
Solution Approach 1:
The oxygen plasma treatment step is merged with the existing plasma etching process by using the same plasma processing equipment. This integration allows the surface treatment to be performed in the same chamber without requiring additional equipment, thereby reducing overall process complexity while maintaining surface hydrophilicity.
Solution Approach 2:
The plasma processing equipment is used for multiple functions: first for fluorine-based plasma etching to form via-holes, and then for oxygen plasma treatment to modify surface properties. This multi-functionality reduces the need for separate equipment and simplifies the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively allows the electroplating solution to enter the via-holes, ensuring the formation of desired copper via-holes without defects, thereby producing electronic components with reliable electrical connections.
Implementation Method 1
performing oxygen ashing treatment on an inner surface of the recess portion
Implementation Method 2
the surface of the organic resin layer, which becomes hydrophobic due to etching using the gas including fluorine, is subjected to hydrophilization treatment by oxygen ashing
Implementation Method 3
performing plasma etching on the second metal layer by using a reactant gas including fluorine via the mask to thereby form a recess portion in a layered film of the organic resin layer and the second metal layer
Implementation Method 4
the surface of the organic resin layer (mask) is fluorinated and the fluoride is formed on the surface
Implementation Method 5
forming a third metal layer in the recess portion by electroplating treatment after the oxygen ashing treatment
Data Source
AI summary
A manufacturing method for an electronic component according to an aspect of the present invention includes: forming a first metal layer on a substrate; forming a second metal layer on the first metal layer; forming a mask made of an organic resin layer on the second metal layer; performing plasma etching on the second metal layer by using a reactant gas including fluorine via the mask to thereby form a recess portion in a layered film of the organic resin layer and the second metal layer; performing oxygen ashing treatment on an inner surface of the recess portion; and forming a third metal layer in the recess portion by electroplating treatment after the oxygen ashing treatment.