Configurable Dual Position Magnetron for TiN Deposition
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Solution Overview
Problem
Titanium nitride (TiN) layers used in semiconductor applications tend to crack, peel, and flake, leading to defects due to inherent stress, which is not effectively addressed by existing sputtering technologies.
Innovation Solution
A dual position magnetron assembly with a configurable magnetic field, allowing for two different closed track configurations by rotating sections of the magnet, which maximizes target utilization and maintains a low cathode voltage, thereby reducing particle defects during deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional sputtering technology is used to deposit TiN layers, then the deposition process can be completed, but the TiN layers develop inherent stress causing cracking, peeling, and flaking defects
Solution Approach 1:
The magnetron assembly incorporates a movable second base plate that can be positioned at different locations to dynamically adjust the magnetic field configuration. This dynamic adjustment allows optimization of the closed track magnetic field geometry to reduce inherent stress in the deposited TiN layer while maintaining reliable film integrity
Solution Approach 2:
The invention changes the magnetic field parameters by repositioning the second base plate, which alters the closed track configuration and magnetic field distribution. This parameter change optimizes the deposition process to minimize inherent stress and prevent cracking, peeling, and flaking defects in the TiN layer
2Productivity
If a fixed magnetron configuration is used, then the device structure is simple, but target utilization is not maximized and particle defects occur
Solution Approach 1:
The second base plate is designed to be movable relative to the first base plate, enabling dynamic reconfiguration of the magnetron assembly. This dynamic capability allows the system to optimize target utilization by adjusting the magnetic field track configuration while maintaining manageable device complexity through a straightforward mechanical positioning mechanism
Solution Approach 2:
The magnetron assembly is segmented into two separate base plates (first and second base plates) that can be independently positioned. This segmentation allows flexible configuration of the magnetic field components to maximize target utilization without requiring complete redesign of the entire magnetron structure
3Reliability
If the magnetic field configuration is not optimized, then the device operation is simple, but particle defects are generated during deposition
Solution Approach 1:
The movable second base plate enables dynamic optimization of the magnetic field configuration to eliminate particle defects and improve deposition quality. The ease of operation is maintained through a simple positioning mechanism that allows straightforward adjustment of the base plate to achieve optimal closed track configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual position magnetron assembly effectively reduces particle defects and maintains high target cleanliness, enabling efficient deposition of TiN films with improved uniformity and reduced stress, thus addressing the cracking and flaking issues of TiN layers.
Implementation Method 1
an outer magnetic pole in the shape of a loop and comprising an outer magnetic pole section coupled to the first base plate and an outer magnetic pole section coupled to the second base plate; and an inner magnetic pole disposed within the outer magnetic pole, wherein the outer and inner magnetic poles define a closed loop magnetic field
Implementation Method 2
Sputtering, alternatively called physical vapor deposition (PVD), has long been used in depositing metals and related materials in the fabrication of semiconductor integrated circuits
Implementation Method 3
a second base plate movable with respect to the first base plate between a first position and a second position... the closed loop magnetic field has a first geometric configuration when the second base plate is disposed in the first position and a second geometric configuration, different than the first geometric configuration, when the second base plate is disposed in the second position
Data Source
AI summary
Methods and apparatus for a magnetron assembly are provided herein. In some embodiments, a magnetron assembly includes a first base plate; a second base plate movable with respect to the first base plate between a first position and a second position; an outer magnetic pole in the shape of a loop and comprising an outer magnetic pole section coupled to the first base plate and an outer magnetic pole section coupled to the second base plate; and an inner magnetic pole disposed within the outer magnetic pole, wherein the outer and inner magnetic poles define a closed loop magnetic field, and wherein the closed loop magnetic field is maintained when the second base plate is disposed in both the first position and a second position.