Grid-Structured Substrate Tray for Thin-Film Formation
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Solution Overview
Problem
Conventional substrate trays for thin-film formation devices suffer from poor heat conduction efficiency and non-uniform heating due to the thickness of the tray body and incomplete adhesion to the heater, leading to inconsistent film quality in plasma CVD or heat CVD processes.
Innovation Solution
A substrate tray design featuring partition frames with a grid structure and wires supporting the substrate, allowing direct radiant heat transfer and tension mechanisms to maintain uniform temperature distribution, ensuring the substrate is securely positioned between the partition frames and the heating element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the substrate tray body has sufficient thickness to maintain strength, then structural strength is improved, but heat conduction efficiency deteriorates and heating uniformity worsens
Solution Approach 1:
The substrate tray body is divided into multiple thin plate members (first plate member, second plate member, third plate member, fourth plate member) arranged in a grid pattern, replacing a single thick tray body. This segmentation maintains structural strength while reducing thermal resistance and improving heat conduction efficiency from the heater to the substrate.
2Temperature
If the substrate tray body is heated through conduction, then heating is achieved, but heating uniformity deteriorates due to incomplete adhesion from warp or distortion
Solution Approach 1:
The tray body is segmented into multiple thin plates that can conform better to the heater surface, improving contact area and heat transfer uniformity while reducing warp and distortion effects that cause incomplete adhesion.
Solution Approach 2:
The invention introduces a grid-like three-dimensional structure with multiple plate members spaced apart, creating a skeletal framework that improves both mechanical strength and thermal contact with the heater surface, eliminating the need for complete adhesion while achieving uniform heating.
3Ease of operation
If the substrate is engaged in a recess on the substrate tray body, then substrate positioning is achieved, but heat conduction efficiency deteriorates and film formation uniformity worsens
Solution Approach 1:
The substrate engagement structure is extracted from the traditional recess design. Instead of embedding the substrate in a recess, the invention uses a grid of plate members that surround and support the substrate from the sides, eliminating the thermal barrier of a thick recess bottom while maintaining secure positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat transfer efficiency, reduces heating time, and achieves uniform temperature distribution across the substrate, resulting in improved film formation quality and uniformity.
Implementation Method 1
due to that the substrate is heated by conduction heat through the substrate tray, heat conduction efficiency becomes bad
Implementation Method 2
allowing direct radiant heat transfer
Data Source
AI summary
Provided is a substrate tray which is to be used in a thin-film formation device and makes it easy to improve film quality and film thickness uniformity on a substrate by improving substrate heating efficiency and substrate heating uniformity. Thus, a substrate tray to be used in a thin-film formation device and characterized in that: wherein there are formed substrate mountable spaces each of which substantially corresponds to a substrate shape by installing partition frames arranged in matrix each of which has a substantial quadrangular frame shape within an outer frame and by partitioning inside of the outer frame in a grid, wherein a plurality of wires are installed between front and rear side frames mutually opposing within the outer frame and each partition frame is connected and supported by the wires, and wherein the substrate is mountable on a substrate support portion of a lower partition frame joined to a bottom surface of an upper partition frame in the partition frame or on the wires crossing the substrate mountable spaces.