Rotary Sputtering Target Plated Bonding Surface

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Solution Overview

Problem

Current rotary sputtering target assemblies face challenges in achieving strong and consistent bonding between the target material and the backing tube, particularly with non-castable materials, leading to issues with thermal contact and bonding strength, and the reuse of backing tubes is laborious due to secure adhesive bonds.

Innovation Solution

A rotary sputtering target assembly with a stainless steel backing tube plated with a stack of negative copper, positive copper, and silver layers, bonded to the target using solder, ensuring a strong and easily wettable surface for bonding, facilitating effective thermal transfer and easy disassembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesive bonding is used to attach the target to the backing tube, then bonding strength is improved, but ease of disassembly deteriorates

Engineering Contradiction:

Improvebonding strengthVSAvoidease of disassembly

Core Design Contradiction:

StrengthVSEase of repair

Solution Approach 1:

The bonding interface is segmented into multiple functional layers: the copper plating layer provides strong metallurgical bonding, while the zinc oxide intermediate layer acts as a sacrificial bonding agent that can be easily removed. This segmentation allows the bond to be strong during operation but easily separable during maintenance by simply removing the zinc oxide layer.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The zinc oxide layer serves as an intermediary between the copper plating and the target material. It provides adequate bonding strength for operation but can be easily removed, facilitating simple disassembly and target replacement without damaging the backing tube or copper plating.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Strength

If the backing tube surface is made highly reactive for bonding, then bonding strength is improved, but ease of manufacture deteriorates

Engineering Contradiction:

Improvebonding strengthVSAvoidease of manufacture

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The copper plating and zinc oxide coating are applied to the backing tube surface in advance, before the target is installed. This preliminary preparation creates a surface that is highly reactive and conducive to bonding, while the plating process itself is a standard, easily manufactured operation that does not require complex post-processing or specialized equipment.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides a robust and efficient bonding method that enhances thermal contact and simplifies the reuse of backing tubes by ensuring a strong, consistent bond and easy removal of target material, improving the overall performance and efficiency of the sputtering process.

Implementation Method 1

facilitating effective thermal transfer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

bonded to the target using solder

Methodology Applied

Scientific EffectSoldering: Soldering

Data Source

PatentUS9556511B2Plating stack to condition a bonding surface

Publication Date: 2017.01.31 MATERION CORP

AI summary

A rotary sputtering target assembly and method of making the same including a target and a backing tube having a plated bonding surface. The backing tube and the target are bonded together along the plated bonding surface.