Plasma Processing Apparatus Lower Electrode Circuit

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Solution Overview

Problem

Existing plasma processing technologies face challenges in controlling the energy of ions incident on the lower electrode, leading to inefficiencies in substrate processing during plasma generation.

Innovation Solution

A plasma processing apparatus is designed with a circuit comprising a rectifier, capacitor, and current paths between the lower electrode and ground, allowing controlled potential adjustment of the lower electrode through a capacitor, thereby managing RF power and sheath voltage to reduce ion energy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If the lower electrode potential is controlled to reduce ion energy incident on the electrode, then ion damage to the substrate is reduced, but the circuit complexity increases due to the need for rectifiers and capacitors

Engineering Contradiction:
Improveion energy incident on lower electrodeVSAvoidcircuit complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

A rectifier and capacitor are introduced as intermediary components between the lower electrode and ground. The rectifier converts RF voltage to DC voltage, and the capacitor smooths this voltage to create a controlled DC potential on the lower electrode. This intermediary circuitry enables precise control of ion energy by adjusting the DC potential, thereby reducing harmful ion incident energy while maintaining manageable circuit complexity through standardized components

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The lower electrode potential is changed from a purely RF-driven potential to a controlled DC potential superimposed on the RF potential. By adjusting the DC voltage parameter through the rectifier-capacitor circuit, the ion energy incident on the lower electrode can be independently controlled without affecting the plasma generation process, thus reducing ion damage while keeping the circuit configuration relatively simple

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If the lower electrode potential is adjusted to control ion energy, then plasma processing precision is improved, but the control system complexity increases

Engineering Contradiction:
Improveplasma processing precisionVSAvoidcontrol system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

A voltage detection unit is incorporated to monitor the actual voltage applied to the lower electrode in real-time. This feedback mechanism allows the control system to verify that the intended DC potential is correctly established, ensuring precise control of ion energy. The feedback loop enables automatic adjustment and maintains processing precision while preventing uncontrolled variations that would require more complex control systems

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The rectifier-capacitor circuit automatically generates the DC potential component without requiring an external DC power supply or complex control circuitry. The circuit self-regulates by rectifying the RF voltage and storing energy in the capacitor, providing a stable DC bias that simplifies the overall control system while maintaining precise control over the lower electrode potential and thus plasma processing precision

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively controls the amount of ions and energy incident on the substrate, enhancing plasma processing efficiency by adjusting the lower electrode's potential and sheath voltage.

Implementation Method 1

The rectifier is configured to allow a current to flow toward the capacitor in the first current path and to allow a current to flow toward the lower electrode in the second current path

Methodology Applied
Scientific EffectRectification: Diode

Implementation Method 2

the capacitor is electrically connected between the rectifier and the ground... The second circuit is electrically connected to the capacitor and is configured to provide a voltage generated in the capacitor

Methodology Applied
Scientific EffectCapacitance: Capacitance

Implementation Method 3

The RF power supply is configured to generate plasma of the processing gas by applying an RF voltage to the upper electrode

Methodology Applied
Scientific EffectPlasma generation: Plasma

Data Source

PatentUS20230038750A1Plasma processing apparatus
Publication Date: 2023.02.09 TOKYO ELECTRON LTD
  • US20230038750A1 patent drawing
  • US20230038750A1 patent drawing
  • US20230038750A1 patent drawing

AI summary

A plasma processing apparatus is provided. The apparatus comprises a chamber, a lower electrode, an upper electrode, a gas supply, an RF power supply and a circuit. The circuit is configured to provide a potential to the lower electrode and includes a first circuit and a second circuit. The first circuit has a rectifier, a capacitor, a first current path, and a second current path. In the first current path, the rectifier is electrically connected between the lower electrode and the capacitor, and the capacitor is electrically connected between the rectifier and the ground. In the second current path, the rectifier is electrically connected between the lower electrode and the ground. The rectifier is configured to allow a current to flow toward the capacitor in the first current path and to allow a current to flow toward the lower electrode in the second current path. The second circuit is electrically connected to the capacitor and is configured to provide a voltage generated in the capacitor.